Inventor
CHUN DO SUNG
TH7 patents
Patents
7 patentsUS6798049B1Sep 28, 2004
Semiconductor package and method for fabricating the same
AMKOR TECHNOLOGY INC125 citations98
US6515356B1Feb 4, 2003
Semiconductor package and method for fabricating the same
AMKOR TECHNOLOGY INC79 citations97
US6982488B2Jan 3, 2006
Semiconductor package and method for fabricating the same
AMKOR TECHNOLOGY INC45 citations96
US7211900B2May 1, 2007
Thin semiconductor package including stacked dies
AMKOR TECHNOLOGY INC26 citations92
US6717248B2Apr 6, 2004
Semiconductor package and method for fabricating the same
AMKOR TECHNOLOGY INC27 citations89
US7190071B2Mar 13, 2007
Semiconductor package and method for fabricating the same
AMKOR TECHNOLOGY INC13 citations83
USRE40112EFeb 26, 2008
Semiconductor package and method for fabricating the same
AMKOR TECHNOLOGY INC1 citations52