Inventor

DICAPRIO VINCENT

US51 patents

⚠️ This page may combine multiple inventors who share the name “DICAPRIO VINCENT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DICAPRIO VINCENT

AMKOR TECHNOLOGY INC

Multi-stacked memory package

Semiconductor memory cards and method of making same

Chip size semiconductor packages with stacked dies

Semiconductor package with spacer strips

Semiconductor package and method for fabricating the same

Semiconductor package having semiconductor chip within central aperture of substrate

Method of making a semiconductor package including stacked semiconductor dies

Semiconductor package including stacked semiconductor dies and bond wires

Package for stacked integrated circuits

Wafer level production of chip size semiconductor packages

Semiconductor package and method for fabricating the same

Semiconductor package and method for fabricating the same

Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages

Making semiconductor packages with stacked dies and reinforced wire bonds

Semiconductor package and method for fabricating the same

Embedded heat spreader ball grid array

Semiconductor package and method for manufacturing the same

Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques

Low profile package for plural semiconductor dies

Fabricating very thin chip size semiconductor packages

Thin semiconductor package including stacked dies

Stackable semiconductor package having semiconductor chip within central through hole of substrate

Semiconductor package and method for manufacturing the same

Semiconductor device and method of manufacturing such device

Semiconductor package and method for fabricating the same

Circuit board semiconductor package

Method of making an integrated circuit package using a batch step for curing a die attachment film and a tool system for performing the method

Semiconductor package and method for fabricating the same

APPLIED MATERIALS INC

Package structure and fabrication methods

Package structure and fabrication methods

Method for via formation by micro-imprinting

Package structure with embedded core

Method for via formation in flowable epoxy materials by micro-imprint

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Package core assembly and fabrication methods

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Package core assembly and fabrication methods

Package structure and fabrication methods

Package core assembly and fabrication methods

Package core assembly and fabrication methods

Package structure and fabrication methods

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Method for collective dishing of singulated dies

Modular mainframe layout for supporting multiple semiconductor process modules or chambers

Modular mainframe layout for supporting multiple semiconductor process modules or chambers

Method of fine redistribution interconnect formation for advanced packaging applications

Modular mainframe layout for supporting multiple semiconductor process modules or chambers

DICAPRIO VINCENT

Semiconductor memory card