Inventor

LI YUZHUO

US36 patents

⚠️ This page may combine multiple inventors who share the name “LI YUZHUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LI YUZHUO

BASF SE

Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitors

Chemical mechanical polishing (CMP) composition comprising a protein

Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitors

Post chemical-mechanical-polishing (post-CMP) cleaning composition comprising a specific sulfur-containing compound and a sugar alcohol or a polycarboxylic acid

Chemical mechanical polishing (CMP) composition comprising a non-ionic surfactant and a carbonate salt

Chemical-mechanical polishing composition comprising organic/inorganic composite particles

Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (CMP) of III-V material in the presence of a CMP composition comprising a specific non-ionic surfactant

RAMAN VIJAY IMMANUEL

Aqueous metal polishing agent comprising a polymeric abrasiv containing pendant functional groups and its use in a CMP process

Process for removing a bulk material layer from a substrate and a chemical mechanical polishing agent suitable for this process

Chemical mechanical polishing composition comprising polyvinyl phosphonic acid and its derivatives

Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers

Process for removing a bulk material layer from a substrate and a chemical mechanical polishing agent suitable for this process

Aqueous polishing agent and graft copolymers and their use in a process for polishing patterned and unstructured metal surfaces

Aqueous polishing agent comprising solid polymer particles and two complexing agents and its use in a process for polishing patterned and unstructured metal surfaces

LI YUZHUO

Chemical mechanical polishing (CMP) composition comprising a glycoside

Chemical mechanical polishing (CMP) polishing solution with enhanced performance

Oxidizing particles based slurry for nobel metal including ruthenium chemical mechanical planarization

Method for forming through-base wafer vias

GEN ELECTRIC

Diamond slurry for chemical-mechanical planarization of semiconductor wafers

Diamond slurry for chemical-mechanical planarization of semiconductor wafers

PPG IND OHIO INC

Silica-based slurry

Silica and silica-based slurry

FERRO CORP

Method of fabricating a copper damascene structure

Slurry for chemical-mechanical polishing copper damascene structures

DYNEA CHEMICALS OY

Non-polymeric organic particles for chemical mechanical planarization

Engineered non-polymeric organic particles for chemical mechanical planarization

NOLLER BASTIAN MARTEN

Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of elemental germanium and/or Si1-xGex material in the presence of a CMP composition comprising a specific organic compound

Chemical mechanical polishing (CMP) composition comprising a polymeric polyamine

DYNEA CANADA LTD

Abrasive composition containing organic particles for chemical mechanical planarization

TBW IND INC

Chemical mechanical planarization process control utilizing in-situ conditioning process

PERSEE CHEMICAL CO LTD

Photo-chemical remediation of Cu-CMP waste

UNIV ZHEJIANG

Woody rootstock for efficient grafting of solanaceous vegetables and efficient grafting and seedling culture method thereof

SCHMITT CHRISTINE

Chemical mechanical polishing (CMP) composition comprising a specific heteropolyacid

KUJAT CHRISTOF

Abrasive articles, method for their preparation and method of their use

LAUTER MICHAEL

Chemical mechanical polishing (CMP) composition comprising inorganic particles and polymer particles

NOLLER BASTIAN

Chemical mechanical polishing (CMP) composition comprising two types of corrosion inhibitors