Inventor

WOLTER ANDREAS

DE73 patents

⚠️ This page may combine multiple inventors who share the name “WOLTER ANDREAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WOLTER ANDREAS

INTEL CORP

Microelectronic package having a passive microelectronic device disposed within a package body

Antenna on ceramics for a packaged die

Three dimensional structures within mold compound

Package stacking using chip to wafer bonding

Bare-die smart bridge connected with copper pillars for system-in-package apparatus

Package stacking using chip to wafer bonding

Single metal cavity antenna in package connected to an integrated transceiver front-end

Package integrated cavity resonator antenna

Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory

Assembly of 2XD module using high density interconnect bridges

Bare-die smart bridge connected with copper pillars for system-in-package apparatus

Assembly of 2XD module using high density interconnect bridges

Vertical and lateral interconnects between dies

Interconnect structure for stacked die in a microelectronic device

Vertical inductor for WLCSP

Resonant LC tank package and method of manufacture

Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics

Vertical inductor for WLCSP

Semiconductor inductors

INTEL IP CORP

System-in-package devices and methods for forming system-in-package devices

Semiconductor device with capacitive coupling structure

Electrical device and a method for forming an electrical device

Vertical inductor for WLCSP

Integrated circuit packages including an optical redistribution layer

Conductive paths through dielectric with a high aspect ratio for semiconductor devices

Resonant LC tank package and method of manufacture

Component magnetic shielding for microelectronic devices

Integrated circuit package configurations to reduce stiffness

Integrated circuit devices with front-end metal structures

Vertical wire connections for integrated circuit package

Interconnect structure for a microelectronic device

Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory

VORWERK CO INTERHOLDING

Detergent and method for producing the same

Urea-formaldehyde foam detergent and method of manufacture using a thixotropic agent

Composition for cleaning textile surfaces

SIGMA ALDRICH CO

Method for immobilizing oligonucleotides employing the cycloaddition bioconjugation method

Activators for oligonucleotide and phosphoramidite synthesis

QIMONDA AG

Integrated circuit package with a heat dissipation device

Semiconductor device with an interconnect element and method for manufacture

INFINEON TECHNOLOGIES AG

Semiconductor device

Flexible contact-connection device

MICROSOFT TECHNOLOGY LICENSING LLC

Centralized access control for cloud relational database management system resources

Centralized access control for cloud relational database management system resources

INTEL MOBILE COMM GMBH

Chip package-in-package and method thereof

PROLICO LLC

Nucleic acid probes and methods to detect and/or quantify nucleic acid analytes

ZUDOCK FRANK

Semiconductor device

INTEL DEUTSCHLAND GMBH

Chip package-in-package

LEUCK MICHAEL

Process for the synthesis of oligonucleotides

MEYER THORSTEN

Semiconductor device with chip having low-k-layers

MARUTHAMUTHU SARAVANA

Bulk acoustic wave resonator tuner circuits