Inventor

PAN YAOLING

US41 patents

⚠️ This page may combine multiple inventors who share the name “PAN YAOLING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PAN YAOLING

NANOSYS INC

Systems and methods for nanowire growth and harvesting

System and process for producing nanowire composites and electronic substrates therefrom

Nanowire varactor diode and methods of making same

Gate configuration for nanowire electronic devices

Systems and methods for harvesting and integrating nanowires

System and process for producing nanowire composites and electronic substrates therefrom

Contact doping and annealing systems and processes for nanowire thin films

System and process for producing nanowire composites and electronic substrates therefrom

Method of fabricating gate configurations for an improved contacts in nanowire based electronic devices

Selective processing of semiconductor nanowires by polarized visible radiation

Gating configurations and improved contacts in nanowire-based electronic devices

Nanowire capacitor and methods of making same

Systems and methods for nanowire growth and harvesting

Methods for oriented growth of nanowires on patterned substrates

Systems and methods for harvesting and reducing contamination in nanowires

Fully integrated organic layered processes for making plastic electronics based on conductive polymers and semiconductor nanowires

APPLIED MATERIALS INC

Sensors and system for in-situ edge ring erosion monitor

Differential capacitive sensors for in-situ film thickness and dielectric constant measurement

Capacitive sensor for monitoring gas concentration

Capacitive sensor for monitoring gas concentration

Capacitive sensor housing for chamber condition monitoring

Capacitive sensor housing for chamber condition monitoring

Differential capacitive sensor for in-situ film thickness and dielectric constant measurement

Capacitive sensing data integration for plasma chamber condition monitoring

Capacitive sensing data integration for plasma chamber condition monitoring

Capacitive sensors and capacitive sensing locations for plasma chamber condition monitoring

Resonant process monitor

Capacitive sensor for chamber condition monitoring

OBSIDIAN SENSORS INC

Capping plate for panel scale packaging of MEMS products

MEMS and NEMS structures

MEMS and NEMS structures

Integrated packaging devices and methods with backside interconnections

Integrated packaging devices and methods with backside interconnections

Panel level packaging for MEMS application

AGILENT TECHNOLOGIES INC

Micro soldering method and apparatus

Efficient thermal activation optical switch and method of making the same

QUALCOMM MEMS TECHNOLOGIES INC

EMS device having flexible support posts

SNAPTRACK INC

Interferometric modulator mirror design without metal layer in the hinge

KIM CHEONHONG

Amorphous oxide semiconductor thin film transistor fabrication method

HONG JOHN HYUNCHUL

Thin film stack with surface-conditioning buffer layers and related methods

PAN YAOLING

Stacked vias for vertical integration