Inventor
RING ZOLTAN
US24 patents
⚠️ This page may combine multiple inventors who share the name “RING ZOLTAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CREE INC
18 patentsUS7906799B2Mar 15, 2011
Nitride-based transistors with a protective layer and a low-damage recess
CREE INC122 citations99
US7045404B2May 16, 2006
Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof
CREE INC184 citations99
US6946739B2Sep 20, 2005
Layered semiconductor devices with conductive vias
CREE INC105 citations99
US6649497B2Nov 18, 2003
Method of forming vias in silicon carbide and resulting devices and circuits
CREE INC113 citations99
US6515303B2Feb 4, 2003
Method of forming vias in silicon carbide and resulting devices and circuits
CREE INC140 citations99
US6475889B1Nov 5, 2002
Method of forming vias in silicon carbide and resulting devices and circuits
CREE INC148 citations99
US7125786B2Oct 24, 2006
Method of forming vias in silicon carbide and resulting devices and circuits
CREE INC121 citations98
US7892974B2Feb 22, 2011
Method of forming vias in silicon carbide and resulting devices and circuits
CREE INC80 citations97
US7855401B2Dec 21, 2010
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides
CREE INC97 citations97
US7525122B2Apr 28, 2009
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides
CREE INC22 citations92
US9812338B2Nov 7, 2017
Encapsulation of advanced devices using novel PECVD and ALD schemes
CREE INC8 citations83
US7858460B2Dec 28, 2010
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides
CREE INC10 citations83
US9761439B2Sep 12, 2017
PECVD protective layers for semiconductor devices
CREE INC2 citations72
US9934983B2Apr 3, 2018
Stress mitigation for thin and thick films used in semiconductor circuitry
CREE INC2 citations68
US8994073B2Mar 31, 2015
Hydrogen mitigation schemes in the passivation of advanced devices
CREE INC2 citations63
US10367074B2Jul 30, 2019
Method of forming vias in silicon carbide and resulting devices and circuits
CREE INC0 citations52
US9530647B2Dec 27, 2016
Devices including ultra-short gates and methods of forming same
CREE INC0 citations51
US9269662B2Feb 23, 2016
Using stress reduction barrier sub-layers in a semiconductor die
CREE INC0 citations41