P

Inventor

RING ZOLTAN

US24 patents
⚠️ This page may combine multiple inventors who share the name “RING ZOLTAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CREE INC

18 patents
US7906799B2Mar 15, 2011

Nitride-based transistors with a protective layer and a low-damage recess

CREE INC122 citations99
US7045404B2May 16, 2006

Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof

CREE INC184 citations99
US6946739B2Sep 20, 2005

Layered semiconductor devices with conductive vias

CREE INC105 citations99
US6649497B2Nov 18, 2003

Method of forming vias in silicon carbide and resulting devices and circuits

CREE INC113 citations99
US6515303B2Feb 4, 2003

Method of forming vias in silicon carbide and resulting devices and circuits

CREE INC140 citations99
US6475889B1Nov 5, 2002

Method of forming vias in silicon carbide and resulting devices and circuits

CREE INC148 citations99
US7125786B2Oct 24, 2006

Method of forming vias in silicon carbide and resulting devices and circuits

CREE INC121 citations98
US7892974B2Feb 22, 2011

Method of forming vias in silicon carbide and resulting devices and circuits

CREE INC80 citations97
US7855401B2Dec 21, 2010

Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides

CREE INC97 citations97
US7525122B2Apr 28, 2009

Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides

CREE INC22 citations92
US9812338B2Nov 7, 2017

Encapsulation of advanced devices using novel PECVD and ALD schemes

CREE INC8 citations83
US7858460B2Dec 28, 2010

Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides

CREE INC10 citations83
US9761439B2Sep 12, 2017

PECVD protective layers for semiconductor devices

CREE INC2 citations72
US9934983B2Apr 3, 2018

Stress mitigation for thin and thick films used in semiconductor circuitry

CREE INC2 citations68
US8994073B2Mar 31, 2015

Hydrogen mitigation schemes in the passivation of advanced devices

CREE INC2 citations63
US10367074B2Jul 30, 2019

Method of forming vias in silicon carbide and resulting devices and circuits

CREE INC0 citations52
US9530647B2Dec 27, 2016

Devices including ultra-short gates and methods of forming same

CREE INC0 citations51
US9269662B2Feb 23, 2016

Using stress reduction barrier sub-layers in a semiconductor die

CREE INC0 citations41

RING ZOLTAN

2 patents

MIECZKOWSKI VAN

2 patents

HAGLEITNER HELMUT

1 patent

SHEPPARD SCOTT T

1 patent