Inventor
ARAKI YUJI
JP40 patents
⚠️ This page may combine multiple inventors who share the name “ARAKI YUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EBARA CORP
27 patentsUS6488774B1Dec 3, 2002
Trap apparatus
EBARA CORP378 citations99
US6282368B1Aug 28, 2001
Liquid feed vaporization system and gas injection device
EBARA CORP104 citations99
US6132512AOct 17, 2000
Vapor-phase film growth apparatus and gas ejection head
EBARA CORP225 citations99
US5951923ASep 14, 1999
Vaporizer apparatus and film deposition apparatus therewith
EBARA CORP275 citations99
US6387182B1May 14, 2002
Apparatus and method for processing substrate
EBARA CORP113 citations97
US6921722B2Jul 26, 2005
Coating, modification and etching of substrate surface with particle beam irradiation of the same
EBARA CORP56 citations96
US6195504B1Feb 27, 2001
Liquid feed vaporization system and gas injection device
EBARA CORP58 citations96
US6269221B1Jul 31, 2001
Liquid feed vaporization system and gas injection device
EBARA CORP16 citations92
US6116267ASep 12, 2000
Valving device
EBARA CORP29 citations92
US5950646ASep 14, 1999
Vapor feed supply system
EBARA CORP23 citations92
USD556692SDec 4, 2007
Electrical contact for use in a plating apparatus
EBARA CORP15 citations84
USD555595SNov 20, 2007
Electrical contact for use in a plating apparatus
EBARA CORP11 citations84
US6458694B2Oct 1, 2002
High energy sputtering method for forming interconnects
EBARA CORP7 citations74
US11352274B2Jun 7, 2022
Gas dissolution supply apparatus and gas dissolution supply method
EBARA CORP2 citations73
US10633757B2Apr 28, 2020
Plating apparatus, plating method, and recording medium
EBARA CORP3 citations73
US11315812B2Apr 26, 2022
Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus
EBARA CORP5 citations71
US12263452B2Apr 1, 2025
Gas solution supply device
EBARA CORP1 citations63
US11648515B2May 16, 2023
Gas solution manufacturing device
EBARA CORP0 citations62
US11584669B2Feb 21, 2023
Gas-dissolved liquid manufacturing device
EBARA CORP0 citations62
US12191178B2Jan 7, 2025
Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus
EBARA CORP0 citations60
US10487415B2Nov 26, 2019
Method of adjusting plating apparatus, and measuring apparatus
EBARA CORP0 citations52
US10100424B2Oct 16, 2018
Method of adjusting plating apparatus, and measuring apparatus
EBARA CORP1 citations52
US9551084B2Jan 24, 2017
Sn alloy plating apparatus and Sn alloy plating method
EBARA CORP1 citations50
US7897024B2Mar 1, 2011
Conducting belt for use with anode holder and anode holder
EBARA CORP1 citations48
US10047454B2Aug 14, 2018
Plating apparatus and plating method
EBARA CORP0 citations42
US9297088B2Mar 29, 2016
Electroplating method and electroplating apparatus for through-hole
EBARA CORP0 citations42
US9816197B2Nov 14, 2017
Sn alloy plating apparatus and Sn alloy plating method
EBARA CORP0 citations40
FUJIKATA JUMPEI
5 patentsUSD649986SDec 6, 2011
Sealing ring
FUJIKATA JUMPEI438 citations98
USD659175SMay 8, 2012
Sealing ring
FUJIKATA JUMPEI21 citations92
USD669439SOct 23, 2012
Electrical contact
FUJIKATA JUMPEI15 citations84
USD651178SDec 27, 2011
Electrical contact for use in a plating apparatus
FUJIKATA JUMPEI15 citations84
US8864965B2Oct 21, 2014
Substrate holder and plating apparatus
FUJIKATA JUMPEI3 citations62