Inventor
TERASHIMA SHINICHI
JP18 patents
⚠️ This page may combine multiple inventors who share the name “TERASHIMA SHINICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNO TOMOHIRO
5 patentsUS8102061B2Jan 24, 2012
Semiconductor device bonding wire and wire bonding method
UNO TOMOHIRO6 citations83
US8247911B2Aug 21, 2012
Wire bonding structure and method for forming same
UNO TOMOHIRO4 citations62
US9427830B2Aug 30, 2016
Copper alloy bonding wire for semiconductor
UNO TOMOHIRO1 citations52
US9112059B2Aug 18, 2015
Bonding wire for semiconductor device
UNO TOMOHIRO0 citations51
US8815019B2Aug 26, 2014
Bonding wire for semiconductor
UNO TOMOHIRO1 citations51
TERASHIMA SHINICHI
4 patentsUS8742258B2Jun 3, 2014
Bonding wire for semiconductor
TERASHIMA SHINICHI9 citations82
US9024442B2May 5, 2015
Solder ball for semiconductor packaging and electronic member using the same
TERASHIMA SHINICHI3 citations57
US8097960B2Jan 17, 2012
Semiconductor mounting bonding wire
TERASHIMA SHINICHI0 citations50
US9296180B2Mar 29, 2016
Metal foil for base material
TERASHIMA SHINICHI1 citations48