Inventor
LIN PANG-CHUN
TW14 patents
⚠️ This page may combine multiple inventors who share the name “LIN PANG-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
8 patentsUS7934313B1May 3, 2011
Package structure fabrication method
SILICONWARE PRECISION INDUSTRIES CO LTD132 citations96
US9362217B2Jun 7, 2016
Package on package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations72
US9177837B2Nov 3, 2015
Fabrication method of semiconductor package having electrical connecting structures
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations62
US8981575B2Mar 17, 2015
Semiconductor package structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US8716861B2May 6, 2014
Semiconductor package having electrical connecting structures and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9029203B2May 12, 2015
Method of fabricating semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9455159B2Sep 27, 2016
Fabrication method of packaging substrate
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations41
US9318354B2Apr 19, 2016
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations41
LIN PANG-CHUN
5 patentsUS8304268B2Nov 6, 2012
Fabrication method of semiconductor package structure
LIN PANG-CHUN5 citations72
US8421199B2Apr 16, 2013
Semiconductor package structure
LIN PANG-CHUN2 citations61
US8390118B2Mar 5, 2013
Semiconductor package having electrical connecting structures and fabrication method thereof
LIN PANG-CHUN2 citations61
US8873244B2Oct 28, 2014
Package structure
LIN PANG-CHUN0 citations49
US8525336B2Sep 3, 2013
Semiconductor package and method of fabricating the same
LIN PANG-CHUN1 citations48