Inventor
LI CHUN-YUAN
TW14 patents
⚠️ This page may combine multiple inventors who share the name “LI CHUN-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
9 patentsUS7934313B1May 3, 2011
Package structure fabrication method
SILICONWARE PRECISION INDUSTRIES CO LTD132 citations96
US7314820B2Jan 1, 2008
Carrier-free semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD74 citations94
US7230323B2Jun 12, 2007
Ground-enhanced semiconductor package and lead frame for the same
SILICONWARE PRECISION INDUSTRIES CO LTD24 citations83
US9362217B2Jun 7, 2016
Package on package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations72
US9177837B2Nov 3, 2015
Fabrication method of semiconductor package having electrical connecting structures
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations62
US7126229B2Oct 24, 2006
Wire-bonding method and semiconductor package using the same
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations59
US8981575B2Mar 17, 2015
Semiconductor package structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US8716861B2May 6, 2014
Semiconductor package having electrical connecting structures and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9130064B2Sep 8, 2015
Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations48
LIN PANG-CHUN
4 patentsUS8304268B2Nov 6, 2012
Fabrication method of semiconductor package structure
LIN PANG-CHUN5 citations72
US8421199B2Apr 16, 2013
Semiconductor package structure
LIN PANG-CHUN2 citations61
US8390118B2Mar 5, 2013
Semiconductor package having electrical connecting structures and fabrication method thereof
LIN PANG-CHUN2 citations61
US8873244B2Oct 28, 2014
Package structure
LIN PANG-CHUN0 citations49