Inventor

LIAO KEN

US12 patents

⚠️ This page may combine multiple inventors who share the name “LIAO KEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MAXIM INTEGRATED PRODUCTS

2 patents

US6303413B1Oct 16, 2001

Method of forming a shallow and deep trench isolation (SDTI) suitable for silicon on insulator (SOI) substrates

MAXIM INTEGRATED PRODUCTS61 citations94

US6861324B2Mar 1, 2005

Method of forming a super self-aligned hetero-junction bipolar transistor

MAXIM INTEGRATED PRODUCTS10 citations72

FORD GLOBAL TECH LLC

2 patents

US10336262B2Jul 2, 2019

Under seat storage bin for flip forward second row seat

FORD GLOBAL TECH LLC22 citations92

US10300810B1May 28, 2019

Seat flip up cushion latch

FORD GLOBAL TECH LLC3 citations71

TAIWAN SEMICONDUCTOR MFG

2 patents

US7754571B2Jul 13, 2010

Method for forming a strained channel in a semiconductor device

TAIWAN SEMICONDUCTOR MFG11 citations83

US7816686B2Oct 19, 2010

Forming silicides with reduced tailing on silicon germanium and silicon

TAIWAN SEMICONDUCTOR MFG7 citations69

MARVELL INT LTD

2 patents

US8710553B1Apr 29, 2014

Method and apparatus for connecting signal lines of multiple layers to certain contacts while preventing connections with other contacts

MARVELL INT LTD0 citations51

US8022443B1Sep 20, 2011

Memory and interconnect design in fine pitch

MARVELL INT LTD0 citations51

TANG QIANG

2 patents

US8482039B1Jul 9, 2013

Memory and interconnect design in fine pitch

TANG QIANG0 citations51

US8278689B1Oct 2, 2012

Memory and interconnect design in fine pitch

TANG QIANG0 citations51

QUALCOMM INC

1 patent

US10333007B2Jun 25, 2019

Self-aligned contact (SAC) on gate for improving metal oxide semiconductor (MOS) varactor quality factor

QUALCOMM INC1 citations61

TAIWAN SEMICONDUCTOR MFG CO LTD

1 patent

US10867816B2Dec 15, 2020

Method and apparatus for wafer backside cooling

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations27