Inventor
CHEN HSU-HSIEN
TW12 patents
⚠️ This page may combine multiple inventors who share the name “CHEN HSU-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
10 patentsUS9490167B2Nov 8, 2016
Pop structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US9478474B2Oct 25, 2016
Methods and apparatus for forming package-on-packages
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations84
US9406629B2Aug 2, 2016
Semiconductor package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US9576821B2Feb 21, 2017
Package structures including a capacitor and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations82
US11315860B2Apr 26, 2022
Semiconductor package and manufacturing process thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations80
US10037973B2Jul 31, 2018
Method for manufacturing semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10535593B2Jan 14, 2020
Package structure having a plurality of conductive balls with narrow width for ball waist
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations70
US10276481B2Apr 30, 2019
Package structure having a plurality of conductive balls having narrow width for the ball waist
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US12451396B2Oct 21, 2025
Semiconductor package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11742276B2Aug 29, 2023
Semiconductor package and manufacturing process thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59