P

Inventor

KANEKO KENTARO

JP53 patents
⚠️ This page may combine multiple inventors who share the name “KANEKO KENTARO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINKO ELECTRIC IND CO

23 patents
US7915088B2Mar 29, 2011

Wiring board manufacturing method, semiconductor device manufacturing method and wiring board

SHINKO ELECTRIC IND CO25 citations93
US8357860B2Jan 22, 2013

Wiring board having a connecting pad area which is smaller than a surface plating layer area

SHINKO ELECTRIC IND CO20 citations92
US9313904B2Apr 12, 2016

Wiring board and method of manufacturing wiring board

SHINKO ELECTRIC IND CO8 citations84
US7954234B2Jun 7, 2011

Method of manufacturing a wiring board

SHINKO ELECTRIC IND CO10 citations84
US7582551B2Sep 1, 2009

Wiring substrate and wiring substrate manufacturing method

SHINKO ELECTRIC IND CO8 citations84
US9253897B2Feb 2, 2016

Wiring substrate and method for manufacturing the same

SHINKO ELECTRIC IND CO3 citations73
US8810040B2Aug 19, 2014

Wiring substrate including projecting part having electrode pad formed thereon

SHINKO ELECTRIC IND CO5 citations73
US9538664B2Jan 3, 2017

Wiring substrate

SHINKO ELECTRIC IND CO5 citations72
US9247644B2Jan 26, 2016

Wiring board and method for manufacturing the same

SHINKO ELECTRIC IND CO4 citations71
US11756866B2Sep 12, 2023

Lead frame and semiconductor device

SHINKO ELECTRIC IND CO2 citations69
US10201917B2Feb 12, 2019

Lead frame

SHINKO ELECTRIC IND CO3 citations68
US9433109B2Aug 30, 2016

Wiring substrate and semiconductor package

SHINKO ELECTRIC IND CO2 citations63
US9258899B2Feb 9, 2016

Method of fabricating a wiring board

SHINKO ELECTRIC IND CO2 citations63
US9089041B2Jul 21, 2015

Method of fabricating a wiring board

SHINKO ELECTRIC IND CO2 citations63
US9006103B2Apr 14, 2015

Method of manufacturing wiring substrate

SHINKO ELECTRIC IND CO2 citations63
US10943857B2Mar 9, 2021

Substrate with multi-layer resin structure and semiconductor device including the substrate

SHINKO ELECTRIC IND CO1 citations62
US11616005B2Mar 28, 2023

Plurality of leads having a two stage recess

SHINKO ELECTRIC IND CO0 citations56
US10381292B2Aug 13, 2019

Lead frame and method of manufacturing lead frame

SHINKO ELECTRIC IND CO0 citations52
US9345143B2May 17, 2016

Method of fabricating a wiring board

SHINKO ELECTRIC IND CO0 citations52
US10276478B2Apr 30, 2019

Lead frame

SHINKO ELECTRIC IND CO0 citations51
US10117336B2Oct 30, 2018

Method of manufacturing a wiring substrate

SHINKO ELECTRIC IND CO1 citations51
US9699912B2Jul 4, 2017

Wiring board

SHINKO ELECTRIC IND CO0 citations51
US9024207B2May 5, 2015

Method of manufacturing a wiring board having pads highly resistant to peeling

SHINKO ELECTRIC IND CO1 citations51

KANEKO KENTARO

11 patents

FLOSFIA INC

8 patents

KOWA CO

4 patents

KOBAYASHI KAZUHIRO

1 patent

OGAWA MICHIRO

1 patent

NAKAMURA JUNICHI

1 patent

AMADA CO LTD

1 patent

Showing the top 50 of 53 patents by PatentIndex Score.