Inventor
KANEKO KENTARO
JP53 patents
⚠️ This page may combine multiple inventors who share the name “KANEKO KENTARO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKO ELECTRIC IND CO
23 patentsUS7915088B2Mar 29, 2011
Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
SHINKO ELECTRIC IND CO25 citations93
US8357860B2Jan 22, 2013
Wiring board having a connecting pad area which is smaller than a surface plating layer area
SHINKO ELECTRIC IND CO20 citations92
US9313904B2Apr 12, 2016
Wiring board and method of manufacturing wiring board
SHINKO ELECTRIC IND CO8 citations84
US7954234B2Jun 7, 2011
Method of manufacturing a wiring board
SHINKO ELECTRIC IND CO10 citations84
US7582551B2Sep 1, 2009
Wiring substrate and wiring substrate manufacturing method
SHINKO ELECTRIC IND CO8 citations84
US9253897B2Feb 2, 2016
Wiring substrate and method for manufacturing the same
SHINKO ELECTRIC IND CO3 citations73
US8810040B2Aug 19, 2014
Wiring substrate including projecting part having electrode pad formed thereon
SHINKO ELECTRIC IND CO5 citations73
US9538664B2Jan 3, 2017
Wiring substrate
SHINKO ELECTRIC IND CO5 citations72
US9247644B2Jan 26, 2016
Wiring board and method for manufacturing the same
SHINKO ELECTRIC IND CO4 citations71
US11756866B2Sep 12, 2023
Lead frame and semiconductor device
SHINKO ELECTRIC IND CO2 citations69
US10201917B2Feb 12, 2019
Lead frame
SHINKO ELECTRIC IND CO3 citations68
US9433109B2Aug 30, 2016
Wiring substrate and semiconductor package
SHINKO ELECTRIC IND CO2 citations63
US9258899B2Feb 9, 2016
Method of fabricating a wiring board
SHINKO ELECTRIC IND CO2 citations63
US9089041B2Jul 21, 2015
Method of fabricating a wiring board
SHINKO ELECTRIC IND CO2 citations63
US9006103B2Apr 14, 2015
Method of manufacturing wiring substrate
SHINKO ELECTRIC IND CO2 citations63
US10943857B2Mar 9, 2021
Substrate with multi-layer resin structure and semiconductor device including the substrate
SHINKO ELECTRIC IND CO1 citations62
US11616005B2Mar 28, 2023
Plurality of leads having a two stage recess
SHINKO ELECTRIC IND CO0 citations56
US10381292B2Aug 13, 2019
Lead frame and method of manufacturing lead frame
SHINKO ELECTRIC IND CO0 citations52
US9345143B2May 17, 2016
Method of fabricating a wiring board
SHINKO ELECTRIC IND CO0 citations52
US10276478B2Apr 30, 2019
Lead frame
SHINKO ELECTRIC IND CO0 citations51
US10117336B2Oct 30, 2018
Method of manufacturing a wiring substrate
SHINKO ELECTRIC IND CO1 citations51
US9699912B2Jul 4, 2017
Wiring board
SHINKO ELECTRIC IND CO0 citations51
US9024207B2May 5, 2015
Method of manufacturing a wiring board having pads highly resistant to peeling
SHINKO ELECTRIC IND CO1 citations51
KANEKO KENTARO
11 patentsUS9210808B2Dec 8, 2015
Wiring substrate and method of manufacturing the same
KANEKO KENTARO17 citations91
US8797757B2Aug 5, 2014
Wiring substrate and manufacturing method thereof
KANEKO KENTARO16 citations84
US8225502B2Jul 24, 2012
Wiring board manufacturing method
KANEKO KENTARO13 citations84
US8067695B2Nov 29, 2011
Wiring board and method of manufacturing the same
KANEKO KENTARO18 citations84
US8754336B2Jun 17, 2014
Wiring board and method of producing the same
KANEKO KENTARO4 citations73
US9236334B2Jan 12, 2016
Wiring substrate and method for manufacturing wiring substrates
KANEKO KENTARO4 citations70
US8476536B2Jul 2, 2013
Wiring substrate and method for manufacturing the same
KANEKO KENTARO2 citations62
US8183467B2May 22, 2012
Wiring board and method of producing the same
KANEKO KENTARO4 citations62
US8779602B2Jul 15, 2014
Wiring board, semiconductor apparatus and method of manufacturing them
KANEKO KENTARO0 citations52
US8610287B2Dec 17, 2013
Wiring substrate and method of manufacturing the same
KANEKO KENTARO1 citations52
US8502398B2Aug 6, 2013
Wiring board, semiconductor apparatus and method of manufacturing them
KANEKO KENTARO0 citations52
FLOSFIA INC
8 patentsUS9711590B2Jul 18, 2017
Semiconductor device, or crystal
FLOSFIA INC8 citations84
US10580648B2Mar 3, 2020
Semiconductor device and method of manufacturing semiconductor device
FLOSFIA INC5 citations70
US11189846B2Nov 30, 2021
Electrically-conductive member and method of manufacturing the same
FLOSFIA INC0 citations62
US11152208B2Oct 19, 2021
Semiconductor film, method of forming semiconductor film, complex compound for doping, and method of doping
FLOSFIA INC1 citations62
US11087977B2Aug 10, 2021
P-type oxide semiconductor and method for manufacturing same
FLOSFIA INC0 citations62
US11916103B2Feb 27, 2024
P-type oxide semiconductor and method for manufacturing same
FLOSFIA INC0 citations59
US11424320B2Aug 23, 2022
P-type oxide semiconductor and method for manufacturing same
FLOSFIA INC0 citations59
US10460934B2Oct 29, 2019
Crystalline film, semiconductor device including crystalline film, and method for producing crystalline film
FLOSFIA INC0 citations50
KOWA CO
4 patentsKOBAYASHI KAZUHIRO
1 patentOGAWA MICHIRO
1 patentNAKAMURA JUNICHI
1 patentAMADA CO LTD
1 patentShowing the top 50 of 53 patents by PatentIndex Score.