Inventor
UEYAMA TOSHIHIKO
JP26 patents
⚠️ This page may combine multiple inventors who share the name “UEYAMA TOSHIHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DOWA ELECTRONICS MATERIALS CO LTD
13 patentsUS11264155B2Mar 1, 2022
Epsilon-type iron oxide magnetic particles and method for producing the same, magnetic powder, magnetic coating material and magnetic recording medium containing magnetic particles
DOWA ELECTRONICS MATERIALS CO LTD2 citations69
US11502294B2Nov 15, 2022
Solution and method for producing the same, and a method for producing active material, for secondary battery
DOWA ELECTRONICS MATERIALS CO LTD0 citations60
US11228030B2Jan 18, 2022
Solution and method for producing the same, and a method for producing active material for secondary battery
DOWA ELECTRONICS MATERIALS CO LTD0 citations60
US11056257B2Jul 6, 2021
Magnetic compound and antenna
DOWA ELECTRONICS MATERIALS CO LTD1 citations60
US7641990B2Jan 5, 2010
Iron compound particles and magnetic recording medium using same
DOWA ELECTRONICS MATERIALS CO LTD0 citations52
US7357980B2Apr 15, 2008
Nonmagnetic powder comprising acicular iron and having specific porosity for a magnetic recording medium, method of manufacturing same, and magnetic recording medium using same
DOWA ELECTRONICS MATERIALS CO LTD1 citations52
US7763352B2Jul 27, 2010
Ferromagnetic powder, and coating material and magnetic recording medium using same
DOWA ELECTRONICS MATERIALS CO LTD0 citations51
US7473469B2Jan 6, 2009
Ferromagnetic powder for a magnetic recording medium, method of producing the powder, and magnetic recording medium using the powder
DOWA ELECTRONICS MATERIALS CO LTD0 citations51
US11114228B2Sep 7, 2021
Magnetic powder composite, antenna and electronic device, and method for producing the same
DOWA ELECTRONICS MATERIALS CO LTD0 citations48
US10090275B2Oct 2, 2018
Bonding method using bonding material
DOWA ELECTRONICS MATERIALS CO LTD0 citations48
US10062473B2Aug 28, 2018
Silver-coated copper alloy powder and method for producing same
DOWA ELECTRONICS MATERIALS CO LTD0 citations48
US10008471B2Jun 26, 2018
Bonding material and bonding method using the same
DOWA ELECTRONICS MATERIALS CO LTD0 citations48
US11866346B2Jan 9, 2024
Composite oxide powder
DOWA ELECTRONICS MATERIALS CO LTD0 citations44
HISAEDA YUTAKA
3 patentsUS8293142B2Oct 23, 2012
Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
HISAEDA YUTAKA7 citations81
US8486310B2Jul 16, 2013
Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
HISAEDA YUTAKA3 citations60
US8293144B2Oct 23, 2012
Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
HISAEDA YUTAKA3 citations60
ENDOH KEIICHI
3 patentsUS8641929B2Feb 4, 2014
Low-temperature-sinterable bonding material, and bonding method using the bonding material
ENDOH KEIICHI9 citations79
US9240256B2Jan 19, 2016
Bonding material and bonding method using the same
ENDOH KEIICHI1 citations58
US8858700B2Oct 14, 2014
Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method
ENDOH KEIICHI1 citations48
THE JIKEI UNIV
2 patentsUS9679670B2Jun 13, 2017
Aggregate of radioactive material removing particles and method of producing the same, and method of removing contaminant
THE JIKEI UNIV0 citations41
US10233099B2Mar 19, 2019
Radioactive cesium decontaminator and method of producing the same, and method of removing the radioactive cesium
THE JIKEI UNIV0 citations30