Inventor
NG MEI CHIN
MY8 patents
⚠️ This page may combine multiple inventors who share the name “NG MEI CHIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
7 patentsUS9475691B1Oct 25, 2016
Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device
INFINEON TECHNOLOGIES AG14 citations80
US9219025B1Dec 22, 2015
Molded flip-clip semiconductor package
INFINEON TECHNOLOGIES AG12 citations80
US10396007B2Aug 27, 2019
Semiconductor package with plateable encapsulant and a method for manufacturing the same
INFINEON TECHNOLOGIES AG4 citations71
US10431560B2Oct 1, 2019
Molded semiconductor package having an optical inspection feature
INFINEON TECHNOLOGIES AG2 citations67
US9806043B2Oct 31, 2017
Method of manufacturing molded semiconductor packages having an optical inspection feature
INFINEON TECHNOLOGIES AG2 citations67
US11081417B2Aug 3, 2021
Manufacturing a package using plateable encapsulant
INFINEON TECHNOLOGIES AG1 citations60
US10490470B2Nov 26, 2019
Semiconductor package and method for fabricating a semiconductor package
INFINEON TECHNOLOGIES AG0 citations42