Inventor
KAWAMATA YUJI
JP30 patents
⚠️ This page may combine multiple inventors who share the name “KAWAMATA YUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SENJU METAL INDUSTRY CO
15 patentsUS6402013B2Jun 11, 2002
Thermosetting soldering flux and soldering process
SENJU METAL INDUSTRY CO46 citations89
US10675719B2Jun 9, 2020
Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint
SENJU METAL INDUSTRY CO3 citations73
US11377715B2Jul 5, 2022
Solder alloy, solder paste, solder ball, solder preform, solder joint, and circuit
SENJU METAL INDUSTRY CO2 citations72
US11819955B2Nov 21, 2023
Solder alloy, solder paste, solder ball, solder preform, solder joint, on-board electronic circuit, ECU electronic circuit, on-board electronic circuit device, and ECU electronic circuit device
SENJU METAL INDUSTRY CO1 citations62
US12031579B2Jul 9, 2024
Sliding member, bearing, sliding member manufacturing method, and bearing manufacturing method
SENJU METAL INDUSTRY CO0 citations61
US10888957B2Jan 12, 2021
Soldering material
SENJU METAL INDUSTRY CO1 citations61
US12194573B2Jan 14, 2025
Solder paste
SENJU METAL INDUSTRY CO0 citations51
US11813686B2Nov 14, 2023
Solder alloy, solder paste, solder ball, solder preform, solder joint, and substrate
SENJU METAL INDUSTRY CO0 citations51
US11571770B2Feb 7, 2023
Solder alloy, solder paste, solder ball, solder preform, and solder joint
SENJU METAL INDUSTRY CO0 citations51
US10811376B2Oct 20, 2020
Cu column, Cu core column, solder joint, and through-silicon via
SENJU METAL INDUSTRY CO0 citations51
US10173287B2Jan 8, 2019
Solder material, solder joint, and method of manufacturing the solder material
SENJU METAL INDUSTRY CO0 citations51
US10147695B2Dec 4, 2018
Cu core ball
SENJU METAL INDUSTRY CO1 citations50
US12544862B2Feb 10, 2026
Flux and solder paste
SENJU METAL INDUSTRY CO0 citations49
US11826860B2Nov 28, 2023
Flux and solder paste
SENJU METAL INDUSTRY CO0 citations49
US10610979B2Apr 7, 2020
Flux composition for solder applications
SENJU METAL INDUSTRY CO0 citations40
KAWAMATA YUJI
7 patentsUS8845826B2Sep 30, 2014
Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solder
KAWAMATA YUJI11 citations82
US8888932B2Nov 18, 2014
Indium-containing lead-free solder for vehicle-mounted electronic circuits
KAWAMATA YUJI2 citations61
US12592080B2Mar 31, 2026
Information processing apparatus, information processing system, and recording medium
KAWAMATA YUJI0 citations51
US11889042B2Jan 30, 2024
Information processing apparatus, information processing system, fee management method, and recording medium that transmits usage fee in response to detecting that first and second users belong to a same group
KAWAMATA YUJI0 citations51
US9073154B2Jul 7, 2015
Flux for lead-free solder and soldering method
KAWAMATA YUJI0 citations48
US11492223B2Nov 8, 2022
Sheet conveying device and image forming apparatus incorporating the sheet conveying device
KAWAMATA YUJI0 citations46
US9227258B2Jan 5, 2016
Lead-free solder alloy having reduced shrinkage cavities
KAWAMATA YUJI1 citations43
TAKEDA CHEMICAL INDUSTRIES LTD
4 patentsUS6228984B1May 8, 2001
Polypeptides their production and use
TAKEDA CHEMICAL INDUSTRIES LTD7 citations73
US6048711AApr 11, 2000
Human G-protein coupled receptor polynucleotides
TAKEDA CHEMICAL INDUSTRIES LTD4 citations62
US6794491B1Sep 21, 2004
Polypeptides, their production and use
TAKEDA CHEMICAL INDUSTRIES LTD0 citations52
US6881545B1Apr 19, 2005
Polypeptides, their production and use
TAKEDA CHEMICAL INDUSTRIES LTD0 citations41