Inventor

KARASHIMA SEIJI

JP42 patents

⚠️ This page may combine multiple inventors who share the name “KARASHIMA SEIJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KARASHIMA SEIJI

PANASONIC CORP

Method for producing connection member

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

Flip chip mounting method and bump forming method

Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same

Process for forming bumps and solder bump

Flip chip mounting process and flip chip assembly

Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

System-in-package optical transceiver in optical communication with a plurality of other system-in-package optical transceivers via an optical transmission line

Flip chip mounting method and method for connecting substrates

Flexible substrate having interlaminar junctions, and process for producing the same

Flip chip mounting method and bump forming method

Flip-chip mounting method and bump formation method

Electronic component mounting method

Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates

Mounted body and method for manufacturing the same

Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body

Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method

Method for forming conductive pattern and wiring board

Flip chip mounting method and bump forming method

Package equipped with semiconductor chip and method for producing same

Flip chip mounting process and flip chip assembly

Bump forming method and bump forming apparatus

Flip chip mounting method and method for connecting substrates

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

Electronic component transporting method

Portable information terminal apparatus

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Connection member and mount assembly and production method of the same

Flexible substrate having interlaminar junctions, and process for producing the same

Portable device

Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus

Mount assembly, optical transmission line and photoelectric circuit board

KITAE TAKASHI

Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates

Flip chip mounting method and bump forming method

Electronic component assembly

Flip-chip mounting resin composition and bump forming resin composition

SAWADA SUSUMU

Flip chip connection structure having powder-like conductive substance and method of producing the same

HIRANO KOICHI

Flip-chip mounting method and bump formation method

NAKATANI SEIICHI

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

ASAHI TOSHIYUKI

Module with a built-in component, and electronic device with the same

TANIGUCHI YASUSHI

Electrode structure and method for forming bump

KARASHIMA SEIJI

Bump forming method using self-assembling resin and a wall surface