P

Inventor

HUNG TZU-HSIANG

TW10 patents
⚠️ This page may combine multiple inventors who share the name “HUNG TZU-HSIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HIWIN MIKROSYSTEM CORP

3 patents
USD784431SApr 18, 2017

Motor

HIWIN MIKROSYSTEM CORP10 citations79
USD784430SApr 18, 2017

Industrial robot module

HIWIN MIKROSYSTEM CORP2 citations68
US9404816B1Aug 2, 2016

Multifunctional load test device

HIWIN MIKROSYSTEM CORP2 citations62

LIN CHIA-SHENG

2 patents
US8878367B2Nov 4, 2014

Substrate structure with through vias

LIN CHIA-SHENG4 citations70
US8786093B2Jul 22, 2014

Chip package and method for forming the same

LIN CHIA-SHENG1 citations51

HUANG YU-LUNG

1 patent
US8692358B2Apr 8, 2014

Image sensor chip package and method for forming the same

HUANG YU-LUNG5 citations71

LOU BAI-YAO

1 patent
US8742564B2Jun 3, 2014

Chip package and method for forming the same

LOU BAI-YAO4 citations70

XINTEC INC

1 patent
US9293394B2Mar 22, 2016

Chip package and method for forming the same

XINTEC INC2 citations62

UNITED MICROELECTRONICS CORP

1 patent
US9443726B1Sep 13, 2016

Semiconductor process

UNITED MICROELECTRONICS CORP1 citations50

HUNG TZU-HSIANG

1 patent
US8779452B2Jul 15, 2014

Chip package

HUNG TZU-HSIANG1 citations45