Inventor
JANG EON SOO
KR11 patents
⚠️ This page may combine multiple inventors who share the name “JANG EON SOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
9 patentsUS11862618B2Jan 2, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD9 citations84
US9029998B2May 12, 2015
Semiconductor package device
SAMSUNG ELECTRONICS CO LTD17 citations83
US10546844B2Jan 28, 2020
Stack package and method of manufacturing the stack package
SAMSUNG ELECTRONICS CO LTD15 citations82
US9842799B2Dec 12, 2017
Semiconductor packages including upper and lower packages and heat dissipation parts
SAMSUNG ELECTRONICS CO LTD7 citations82
US9653373B2May 16, 2017
Semiconductor package including heat spreader and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD7 citations81
US9190338B2Nov 17, 2015
Semiconductor package having a heat slug and a spacer
SAMSUNG ELECTRONICS CO LTD5 citations72
US11205604B2Dec 21, 2021
Semiconductor package including a thermal conductive layer and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US12308363B2May 20, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US9704815B2Jul 11, 2017
Package substrate and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD1 citations50