Inventor
WATANABE MITSUHISA
JP30 patents
⚠️ This page may combine multiple inventors who share the name “WATANABE MITSUHISA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
8 patentsUS6750074B2Jun 15, 2004
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
FUJITSU LTD13 citations92
US6837776B2Jan 4, 2005
Flat-object holder and method of using the same
FUJITSU LTD35 citations91
US6461942B2Oct 8, 2002
Semiconductor chip removing and conveying method and device
FUJITSU LTD24 citations90
US7395847B2Jul 8, 2008
Jig for a semiconductor substrate
FUJITSU LTD9 citations84
US7109561B2Sep 19, 2006
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
FUJITSU LTD4 citations73
US6902944B2Jun 7, 2005
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
FUJITSU LTD5 citations73
US6869819B2Mar 22, 2005
Recognition method of a mark provided on a semiconductor device
FUJITSU LTD4 citations62
US6951800B2Oct 4, 2005
Method of making semiconductor device that has improved structural strength
FUJITSU LTD1 citations52
MICRON TECHNOLOGY INC
6 patentsUS10217719B2Feb 26, 2019
Semiconductor device assemblies with molded support substrates
MICRON TECHNOLOGY INC28 citations94
US10998290B2May 4, 2021
Semiconductor device assemblies with molded support substrates
MICRON TECHNOLOGY INC5 citations84
US9935082B2Apr 3, 2018
Stacked semiconductor dies with selective capillary under fill
MICRON TECHNOLOGY INC7 citations84
US12119325B2Oct 15, 2024
Semiconductor device assemblies with molded support substrates
MICRON TECHNOLOGY INC0 citations62
US10607966B2Mar 31, 2020
Stacked semiconductor dies with selective capillary under fill
MICRON TECHNOLOGY INC0 citations52
US10083941B2Sep 25, 2018
Stacked semiconductor dies with selective capillary under fill
MICRON TECHNOLOGY INC0 citations52
ELPIDA MEMORY INC
5 patentsUS7786564B2Aug 31, 2010
Semiconductor device and method for manufacturing semiconductor device
ELPIDA MEMORY INC2 citations63
US7993975B2Aug 9, 2011
Method of manufacturing semiconductor device including mounting and dicing chips
ELPIDA MEMORY INC2 citations62
US8816478B2Aug 26, 2014
Semiconductor device having penetration electrode penetrating through semiconductor substrate
ELPIDA MEMORY INC3 citations61
US7969019B2Jun 28, 2011
Module with stacked semiconductor devices
ELPIDA MEMORY INC1 citations52
US7812439B2Oct 12, 2010
Semiconductor package with reduced length interconnect and manufacturing method thereof
ELPIDA MEMORY INC0 citations42
WATANABE MITSUHISA
5 patentsUS8203222B2Jun 19, 2012
Semiconductor device and method of manufacturing the same
WATANABE MITSUHISA4 citations60
US8441126B2May 14, 2013
Semiconductor device
WATANABE MITSUHISA0 citations51
US8217517B2Jul 10, 2012
Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each other
WATANABE MITSUHISA0 citations49
US9112061B2Aug 18, 2015
Semiconductor device and method of forming the same
WATANABE MITSUHISA0 citations40
US8810047B2Aug 19, 2014
Semiconductor device and method of manufacturing the same
WATANABE MITSUHISA0 citations39