Inventor
GOLWALKAR SURESH V
US7 patents
Patents
7 patentsUS5366933ANov 22, 1994
Method for constructing a dual sided, wire bonded integrated circuit chip package
INTEL CORP120 citations94
US5545922AAug 13, 1996
Dual sided integrated circuit chip package with offset wire bonds and support block cavities
INTEL CORP92 citations93
US5527740AJun 18, 1996
Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities
INTEL CORP74 citations93
US5336456AAug 9, 1994
Method of producing a scribelined layout structure for plastic encapsulated circuits
INTEL CORP20 citations87
US10420999B2Sep 24, 2019
Sensor-derived object flight performance tracking
INTEL CORP4 citations70
US10960285B2Mar 30, 2021
Sensor-derived object flight performance tracking
INTEL CORP0 citations59
US10049650B2Aug 14, 2018
Ultra-wide band (UWB) radio-based object sensing
INTEL CORP0 citations51