P

Inventor

SHEN YANPING

US28 patents
⚠️ This page may combine multiple inventors who share the name “SHEN YANPING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GLOBALFOUNDRIES US INC

15 patents
US11482456B2Oct 25, 2022

Forming two portion spacer after metal gate and contact formation, and related IC structure

GLOBALFOUNDRIES US INC4 citations73
US11812670B2Nov 7, 2023

Memory device comprising a top via electrode and methods of making such a memory device

GLOBALFOUNDRIES US INC0 citations62
US11785860B2Oct 10, 2023

Top electrode for a memory device and methods of making such a memory device

GLOBALFOUNDRIES US INC1 citations62
US11721728B2Aug 8, 2023

Self-aligned contact

GLOBALFOUNDRIES US INC0 citations62
US11342453B2May 24, 2022

Field effect transistor with asymmetric gate structure and method

GLOBALFOUNDRIES US INC1 citations62
US11264504B2Mar 1, 2022

Active and dummy fin structures

GLOBALFOUNDRIES US INC0 citations62
US11239336B2Feb 1, 2022

Integrated circuit structure with niobium-based silicide layer and methods to form same

GLOBALFOUNDRIES US INC0 citations62
US11171237B2Nov 9, 2021

Middle of line gate structures

GLOBALFOUNDRIES US INC1 citations62
US11094827B2Aug 17, 2021

Semiconductor devices with uniform gate height and method of forming same

GLOBALFOUNDRIES US INC1 citations62
US11569437B2Jan 31, 2023

Memory device comprising a top via electrode and methods of making such a memory device

GLOBALFOUNDRIES US INC0 citations61
US11222844B2Jan 11, 2022

Via structures for use in semiconductor devices

GLOBALFOUNDRIES US INC0 citations61
US11908857B2Feb 20, 2024

Semiconductor devices having late-formed isolation structures

GLOBALFOUNDRIES US INC0 citations52
US11502200B2Nov 15, 2022

Transistor device having sidewall spacers contacting lower surfaces of an epitaxial semiconductor material

GLOBALFOUNDRIES US INC0 citations52
US11437568B2Sep 6, 2022

Memory device and methods of making such a memory device

GLOBALFOUNDRIES US INC0 citations52
US11164794B2Nov 2, 2021

Semiconductor structures in a wide gate pitch region of semiconductor devices

GLOBALFOUNDRIES US INC0 citations51

GLOBALFOUNDRIES INC

12 patents
US10249538B1Apr 2, 2019

Method of forming vertical field effect transistors with different gate lengths and a resulting structure

GLOBALFOUNDRIES INC22 citations94
US9887094B1Feb 6, 2018

Methods of forming EPI semiconductor material on the source/drain regions of a FinFET device

GLOBALFOUNDRIES INC14 citations84
US9443771B1Sep 13, 2016

Methods to thin down RMG sidewall layers for scalability of gate-last planar CMOS and FinFET technology

GLOBALFOUNDRIES INC10 citations84
US10068902B1Sep 4, 2018

Integrated circuit structure incorporating non-planar field effect transistors with different channel region heights and method

GLOBALFOUNDRIES INC4 citations73
US10553707B1Feb 4, 2020

FinFETs having gates parallel to fins

GLOBALFOUNDRIES INC5 citations71
US10811422B2Oct 20, 2020

Semiconductor recess to epitaxial regions and related integrated circuit structure

GLOBALFOUNDRIES INC1 citations62
US10700173B2Jun 30, 2020

FinFET device with a wrap-around silicide source/drain contact structure

GLOBALFOUNDRIES INC0 citations51
US10636894B2Apr 28, 2020

Fin-type transistors with spacers on the gates

GLOBALFOUNDRIES INC0 citations51
US10833171B1Nov 10, 2020

Spacer structures on transistor devices

GLOBALFOUNDRIES INC0 citations42
US10818498B1Oct 27, 2020

Shaped gate caps in spacer-lined openings

GLOBALFOUNDRIES INC0 citations42
US10164010B1Dec 25, 2018

Finfet diffusion break having protective liner in fin insulator

GLOBALFOUNDRIES INC0 citations40
US10461155B2Oct 29, 2019

Epitaxial region for embedded source/drain region having uniform thickness

GLOBALFOUNDRIES INC0 citations35

TENCENT TECH SHENZHEN CO LTD

1 patent