Inventor
BIESELT STEFFEN
DE36 patents
⚠️ This page may combine multiple inventors who share the name “BIESELT STEFFEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES DRESDEN GMBH
23 patentsUS9382111B2Jul 5, 2016
Micromechanical system and method for manufacturing a micromechanical system
INFINEON TECHNOLOGIES DRESDEN GMBH13 citations84
US9263357B2Feb 16, 2016
Carrier with hollow chamber and support structure therein
INFINEON TECHNOLOGIES DRESDEN GMBH6 citations84
US9938133B2Apr 10, 2018
System and method for a comb-drive MEMS device
INFINEON TECHNOLOGIES DRESDEN GMBH10 citations83
US9330929B1May 3, 2016
Systems and methods for horizontal integration of acceleration sensor structures
INFINEON TECHNOLOGIES DRESDEN GMBH8 citations81
US10170497B2Jan 1, 2019
Method for manufacturing an electronic device and method for operating an electronic device
INFINEON TECHNOLOGIES DRESDEN GMBH2 citations73
US9929181B2Mar 27, 2018
Method for manufacturing an electronic device and method for operating an electronic device
INFINEON TECHNOLOGIES DRESDEN GMBH3 citations73
US9560765B2Jan 31, 2017
Electronic device, a method for manufacturing an electronic device, and a method for operating an electronic device
INFINEON TECHNOLOGIES DRESDEN GMBH2 citations73
US9711393B2Jul 18, 2017
Silicon on nothing devices and methods of formation thereof
INFINEON TECHNOLOGIES DRESDEN GMBH2 citations72
US10852319B2Dec 1, 2020
Micromechanical sensor and methods for producing a micromechanical sensor and a micromechanical sensor element
INFINEON TECHNOLOGIES DRESDEN GMBH4 citations71
US10683203B2Jun 16, 2020
Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS process
INFINEON TECHNOLOGIES DRESDEN GMBH1 citations62
US10539587B2Jan 21, 2020
Accelerometer with compatibility to complementary metal-oxide-semiconductor technologies
INFINEON TECHNOLOGIES DRESDEN GMBH1 citations62
US9236241B2Jan 12, 2016
Wafer, a method for processing a wafer, and a method for processing a carrier
INFINEON TECHNOLOGIES DRESDEN GMBH2 citations62
US9136328B2Sep 15, 2015
Silicon on nothing devices and methods of formation thereof
INFINEON TECHNOLOGIES DRESDEN GMBH3 citations62
US10290805B2May 14, 2019
Emitter and method for manufacturing the same
INFINEON TECHNOLOGIES DRESDEN GMBH0 citations52
US10096511B2Oct 9, 2018
Carrier and a method for processing a carrier
INFINEON TECHNOLOGIES DRESDEN GMBH0 citations52
US9938135B2Apr 10, 2018
Stress decoupled piezoresistive relative pressure sensor and method for manufacturing the same
INFINEON TECHNOLOGIES DRESDEN GMBH0 citations52
US9887355B2Feb 6, 2018
Emitter and method for manufacturing the same
INFINEON TECHNOLOGIES DRESDEN GMBH1 citations52
US9716015B2Jul 25, 2017
Carrier and a method for processing a carrier
INFINEON TECHNOLOGIES DRESDEN GMBH1 citations52
US9613878B2Apr 4, 2017
Carrier and a method for processing a carrier
INFINEON TECHNOLOGIES DRESDEN GMBH0 citations52
US10544037B2Jan 28, 2020
Integrated semiconductor device and manufacturing method
INFINEON TECHNOLOGIES DRESDEN GMBH0 citations51
US10354911B2Jul 16, 2019
Silicon on nothing devices and methods of formation thereof
INFINEON TECHNOLOGIES DRESDEN GMBH0 citations51
US9896329B2Feb 20, 2018
Integrated semiconductor device and manufacturing method
INFINEON TECHNOLOGIES DRESDEN GMBH0 citations51
US10580663B2Mar 3, 2020
Microelectromechanical device and method for forming a microelectromechanical device having a support structure holding a lamella structure
INFINEON TECHNOLOGIES DRESDEN GMBH0 citations41
INFINEON TECH DRESDEN GMBH & CO KG
8 patentsUS10961116B2Mar 30, 2021
Micro-mechanical sensor and method for manufacturing a micro-electro-mechanical sensor
INFINEON TECH DRESDEN GMBH & CO KG2 citations73
US10870575B2Dec 22, 2020
Stressed decoupled micro-electro-mechanical system sensor
INFINEON TECH DRESDEN GMBH & CO KG2 citations71
US12477823B2Nov 18, 2025
Semiconductor component including an electronic component based on polycrystalline silicon
INFINEON TECH DRESDEN GMBH & CO KG0 citations62
US12002812B2Jun 4, 2024
Method of producing a semiconductor component and semiconductor component
INFINEON TECH DRESDEN GMBH & CO KG0 citations62
US11078072B2Aug 3, 2021
Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS process
INFINEON TECH DRESDEN GMBH & CO KG0 citations62
US11493532B2Nov 8, 2022
Micromechanical sensor and methods for producing a micromechanical sensor and a micromechanical sensor element
INFINEON TECH DRESDEN GMBH & CO KG0 citations60
US12043539B2Jul 23, 2024
Sensor system with a microelectromechanical sensor element and method for producing a sensor system
INFINEON TECH DRESDEN GMBH & CO KG0 citations58
US12359994B2Jul 15, 2025
Semiconductor die with pressure and acceleration sensor elements
INFINEON TECH DRESDEN GMBH & CO KG0 citations52
INFINEON TECHNOLOGIES AG
5 patentsUS9663354B2May 30, 2017
Mechanical stress-decoupling in semiconductor device
INFINEON TECHNOLOGIES AG3 citations73
US11422151B2Aug 23, 2022
Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device
INFINEON TECHNOLOGIES AG1 citations72
US10684306B2Jun 16, 2020
Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device
INFINEON TECHNOLOGIES AG1 citations72
US12332271B2Jun 17, 2025
Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device
INFINEON TECHNOLOGIES AG0 citations62
US9991340B2Jun 5, 2018
Mechanical stress-decoupling in semiconductor device
INFINEON TECHNOLOGIES AG0 citations52