Inventor
DORIA DARIA
IT2 patents
Patents
2 patentsUS12463163B2Nov 4, 2025
Integrated circuit chip including a passivation nitride layer in contact with a high voltage bonding pad and method of making
ST MICROELECTRONICS SRL0 citations54
US11887948B2Jan 30, 2024
Integrated circuit chip including a passivation nitride layer in contact with a high voltage bonding pad and method of making
ST MICROELECTRONICS SRL0 citations54