P

Inventor

LIAO CHUN-HUNG

TW26 patents
⚠️ This page may combine multiple inventors who share the name “LIAO CHUN-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

21 patents
US11495471B2Nov 8, 2022

Slurry compositions for chemical mechanical planarization

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11267987B2Mar 8, 2022

Chemical mechanical polishing slurry composition and method of polishing metal layer

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12538791B2Jan 27, 2026

Source/drain contact for semiconductor device structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12441912B2Oct 14, 2025

Chemical mechanical polishing slurry composition and method of polishing metal layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12261055B2Mar 25, 2025

Slurry compositions for chemical mechanical planarization

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12176217B2Dec 24, 2024

Method for manufacturing a semiconductor using slurry

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12024651B2Jul 2, 2024

Chemical mechanical polishing slurry composition and method of polishing metal layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11752592B2Sep 12, 2023

Slurry enhancement for polishing system

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11756825B2Sep 12, 2023

Semiconductor structure with oxidized ruthenium

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11735470B2Aug 22, 2023

Method for forming semiconductor device structure with source/drain contact

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11688607B2Jun 27, 2023

Slurry

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11525072B2Dec 13, 2022

Materials and methods for chemical mechanical polishing of ruthenium-containing materials

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10920105B2Feb 16, 2021

Materials and methods for chemical mechanical polishing of ruthenium-containing materials

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12431431B2Sep 30, 2025

Conductive structure interconnects with downward projections

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12269141B2Apr 8, 2025

Fabrication of a polishing pad for chemical mechanical polishing

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11697183B2Jul 11, 2023

Fabrication of a polishing pad for chemical mechanical polishing

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12489063B2Dec 2, 2025

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10964549B2Mar 30, 2021

Wafer polishing with separated chemical reaction and mechanical polishing

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10847410B2Nov 24, 2020

Ruthenium-containing semiconductor structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10727076B2Jul 28, 2020

Slurry and manufacturing semiconductor using the slurry

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12347735B2Jul 1, 2025

In-situ defect count detection in post chemical mechanical polishing

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50

E INK HOLDINGS INC

2 patents

MICROJET TECHNOLOGY CO LTD

2 patents

WU CHEN HAO

1 patent