Inventor
LEE AN-HSUAN
TW12 patents
Patents
12 patentsUS11495471B2Nov 8, 2022
Slurry compositions for chemical mechanical planarization
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11267987B2Mar 8, 2022
Chemical mechanical polishing slurry composition and method of polishing metal layer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12441912B2Oct 14, 2025
Chemical mechanical polishing slurry composition and method of polishing metal layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12261055B2Mar 25, 2025
Slurry compositions for chemical mechanical planarization
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12176217B2Dec 24, 2024
Method for manufacturing a semiconductor using slurry
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12024651B2Jul 2, 2024
Chemical mechanical polishing slurry composition and method of polishing metal layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11752592B2Sep 12, 2023
Slurry enhancement for polishing system
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11688607B2Jun 27, 2023
Slurry
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11525072B2Dec 13, 2022
Materials and methods for chemical mechanical polishing of ruthenium-containing materials
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10920105B2Feb 16, 2021
Materials and methods for chemical mechanical polishing of ruthenium-containing materials
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12269141B2Apr 8, 2025
Fabrication of a polishing pad for chemical mechanical polishing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11697183B2Jul 11, 2023
Fabrication of a polishing pad for chemical mechanical polishing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61