Inventor

WU CHEN-HAO

TW36 patents

⚠️ This page may combine multiple inventors who share the name “WU CHEN-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WU CHEN-HAO

TAIWAN SEMICONDUCTOR MFG CO LTD

Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereof

Fin isolation structure for FinFET and method of forming the same

Method for forming multi-layer mask

Slurry compositions for chemical mechanical planarization

Chemical mechanical polishing slurry composition and method of polishing metal layer

Method for conditioning polishing pad

Chemical mechanical polishing slurry composition and method of polishing metal layer

Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereof

Slurry compositions for chemical mechanical planarization

Method for manufacturing a semiconductor using slurry

Chemical mechanical polishing slurry composition and method of polishing metal layer

Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereof

Semiconductor structure with oxidized ruthenium

Slurry enhancement for polishing system

Slurry

Materials and methods for chemical mechanical polishing of ruthenium-containing materials

Method for conditioning polishing pad

Mechanism for manufacturing semiconductor device

Materials and methods for chemical mechanical polishing of ruthenium-containing materials

Fin isolation structure for FinFET and method of forming the same

Fabrication of a polishing pad for chemical mechanical polishing

Fin isolation structure for FinFET and method of forming the same

Fabrication of a polishing pad for chemical mechanical polishing

Fin isolation structure for FinFET and method of forming the same

Fin isolation structure for FinFET and method of forming the same

Apparatus and methods for chemical mechanical polishing

Mechanism for manufacturing semiconductor device

Method for forming multi-layer mask

Method of manufacturing semiconductor device

Wafer polishing with separated chemical reaction and mechanical polishing

Ruthenium-containing semiconductor structure and method of manufacturing the same

Slurry and manufacturing semiconductor using the slurry

Metal nanoparticles in an amorphous bonding layer between a device substrate and carrier substrate

WU CHEN HAO

Foldable display support

Post CMP cleaning apparatus and post CMP cleaning methods

JARLLYTEC CO LTD

Dual swing hinge structure