Inventor
SAHA AMITESH
US6 patents
Patents
6 patentsUS12272614B2Apr 8, 2025
Integrated circuit packages with solder thermal interface materials with embedded particles
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Integrated circuit packages with thermal interface materials with different material compositions
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Lids for integrated circuit packages with solder thermal interface materials
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Channeled lids for integrated circuit packages
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US12166004B2Dec 10, 2024
Solder thermal interface material (STIM) with dopant
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US11551997B2Jan 10, 2023
Thermal management solutions using self-healing polymeric thermal interface materials
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