Inventor
KOTHARI SHRENIK
US7 patents
Patents
7 patentsUS9515003B1Dec 6, 2016
Embedded air core inductors for integrated circuit package substrates with thermal conductor
INTEL CORP18 citations79
US11756860B2Sep 12, 2023
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
INTEL CORP3 citations71
US12341080B2Jun 24, 2025
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
INTEL CORP0 citations61
US11978689B2May 7, 2024
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
INTEL CORP0 citations61
US11398414B2Jul 26, 2022
Sloped metal features for cooling hotspots in stacked-die packages
INTEL CORP0 citations61
US11551997B2Jan 10, 2023
Thermal management solutions using self-healing polymeric thermal interface materials
INTEL CORP0 citations53
US11495518B2Nov 8, 2022
Multi-surface heat sink suitable for multi-chip packages
INTEL CORP1 citations52