Inventor

MANEPALLI RAHUL N

US66 patents

⚠️ This page may combine multiple inventors who share the name “MANEPALLI RAHUL N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MANEPALLI RAHUL N

INTEL CORP

Capillary-flow underfill compositions, packages containing same, and systems containing same

Adhesive of folded package

Inorganic-based embedded-die layers for modular semiconductive devices

Cavity generation for embedded interconnect bridges utilizing temporary structures

Integrated circuit devices including compliant material under bond pads and methods of fabrication

Underfilling process in a molded matrix array package using flow front modifying solder resist

Package with underfill containment barrier

RFIC having coaxial interconnect and molded layer

Stretchable embedded electronic package

Multichip integration with through silicon via (TSV) die embedded in package

Underfilling process in a molded matrix array package using flow front modifying solder resist

Method of forming molded panel embedded die structure

Embedded die architecture and method of making

Package with underfill containment barrier

Circuit device with monolayer bonding between surface structures

Dielectric filler material in conductive material that functions as fiducial for an electronic device

Integrated circuit substrate and method of making

Nested interposer with through-silicon via bridge die

Electrical interconnect bridge

Electrical interconnect bridge

Stretchable electronic assembly

Solder interconnect hierarchy for heterogeneous electronic device packaging

Inorganic-based embedded-die layers for modular semiconductive devices

Patch accommodating embedded dies having different thicknesses

Inorganic-based embedded-die layers for modular semiconductive devices

Semiconductor package having polymeric interlayer disposed between conductive elements and dielectric layer

Multichip integration with through silicon via (TSV) die embedded in package

Directing the flow of underfill materials using magnetic particles

Surface functionalization of sinx thin film by wet etching for improved adhesion of metal-dielectric for HSIO

Package with underfill containment barrier

Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages

Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches

Package with underfill containment barrier

Molded embedded bridge including routing layers for enhanced EMIB applications

High density package substrate formed with dielectric bi-layer

Embedded die microelectronic device with molded component

Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same

Embedded die microelectronic device with molded component

Die placement and coupling apparatus

Multi-layered adhesion promotion films

Dielectric filler material in conductive material that functions as fiducial for an electronic device

Density-graded adhesion layer for conductors

Apparatus with a substrate provided with plasma treatment

Adhesive of folder package

MANEPALLI RAHUL N

Forming die backside coating structures with coreless packages

Method of fabricating a capillary-flow underfill compositions

RAORANE DIGVIJAY A

Multichip integration with through silicon via (TSV) die embedded in package

PIETAMBARAM SRINIVAS V

Molded embedded bridge for enhanced EMIB applications

XU DINGYING

Flexible underfill compositions for enhanced reliability

START PAUL R

In-situ foam materials as integrated heat spreader (IHS) sealant