Inventor
MAKINO YUTAKA
JP35 patents
⚠️ This page may combine multiple inventors who share the name “MAKINO YUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
10 patentsUS5003692AApr 2, 1991
Electric component mounting method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD84 citations96
US5314175AMay 24, 1994
Wire clamping device and wire clamping method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD47 citations92
US5234105AAug 10, 1993
Packages for circuit boards for preventing oxidation thereof
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD49 citations92
US5033783AJul 23, 1991
Parts mounting apparatus
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD51 citations92
US5018936AMay 28, 1991
Electronic parts engaging apparatus
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD49 citations92
US4817849AApr 4, 1989
Method for bonding semiconductor laser element and apparatus therefor
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD40 citations89
US5153707AOct 6, 1992
Film material for manufacturing film carriers having outer lead portions with inner and outer metallic layers
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7 citations73
US5118556AJun 2, 1992
Film material for film carrier manufacture and a method for manufacturing film carrier
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7 citations73
US5113788AMay 19, 1992
Screen printing machine for through hole printing an electric conductor
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7 citations70
US5017131AMay 21, 1991
Atmosphere furnace
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations62
FUJITSU LTD
6 patentsUS6548898B2Apr 15, 2003
External connection terminal and semiconductor device
FUJITSU LTD98 citations98
US6218281B1Apr 17, 2001
Semiconductor device with flip chip bonding pads and manufacture thereof
FUJITSU LTD162 citations98
US6566239B2May 20, 2003
Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless plating
FUJITSU LTD38 citations93
US6784543B2Aug 31, 2004
External connection terminal and semiconductor device
FUJITSU LTD30 citations92
US6462415B1Oct 8, 2002
Semiconductor device as an object of thickness reduction
FUJITSU LTD51 citations92
US6522016B1Feb 18, 2003
Interconnection structure with film to increase adhesion of the bump
FUJITSU LTD14 citations79
KYOCERA CORP
5 patentsUS7164306B2Jan 16, 2007
Composite multiplexer circuit and chip component, high-frequency module and radio communication apparatus using the same
KYOCERA CORP31 citations92
US9826315B2Nov 21, 2017
Acoustic generator, acoustic generation device, and electronic apparatus
KYOCERA CORP2 citations73
US9392373B2Jul 12, 2016
Acoustic generator, acoustic generation device, and electronic device
KYOCERA CORP0 citations52
US9392372B2Jul 12, 2016
Acoustic generator, acoustic generation device, and electronic device
KYOCERA CORP0 citations51
US9654880B2May 16, 2017
Sound generator and electronic device using the same
KYOCERA CORP0 citations41
HITACHI MAXELL
5 patentsUS9810877B2Nov 7, 2017
Imaging lens system and imaging device
HITACHI MAXELL1 citations52
US7606120B2Oct 20, 2009
Objective lens, optical head, optical system, and design method for objective lens
HITACHI MAXELL0 citations52
US7855940B2Dec 21, 2010
Pickup lens with phase compensator and optical pickup apparatus using the same
HITACHI MAXELL0 citations45
US7586815B2Sep 8, 2009
Pickup lens with phase compensator and optical pickup apparatus using the same
HITACHI MAXELL0 citations45
US7787349B2Aug 31, 2010
Optical pickup lens and optical pickup apparatus
HITACHI MAXELL0 citations39