Inventor

HABA BELGACEM

US652 patents

⚠️ This page may combine multiple inventors who share the name “HABA BELGACEM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HABA BELGACEM

TESSERA INC

Reconstituted wafer level stacking

Flexible lead structures and methods of making same

Stacked microelectronic assembly and method therefor

Forming microelectronic connection components by electrophoretic deposition

Method of making a connection to a microelectronic element

Components with conductive solder mask layers

Stacked microelectronic assembly and method therefor

Low insertion force connector for microelectronic elements

Flexible lead structures and methods of making same

Lidless socket and method of making same

Stackable molded microelectronic packages

Stacked packaging improvements

Stackable molded microelectronic packages

Stacked packaging improvements

Stackable molded microelectronic packages

INVENSAS BONDING TECH INC

Stacked devices and methods of fabrication

Direct-bonded lamination for improved image clarity in optical devices

Interlayer connection of stacked microelectronic components

Molded direct bonded and interconnected stack

Cavity packages

Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein

Bonded structures without intervening adhesive

Microelectronic assemblies

Large metal pads over TSV

Protective elements for bonded structures

Interface structures and methods for forming same

HABA BELGACEM

Microelectronic packages and methods therefor

Stackable microelectronic package structures

Stacked packaging improvements

Stackable molded microelectronic packages

Microelectronic packages and methods therefor

Microelectronic packages and methods therefor

Cavities containing multi-wiring structures and devices

Multi-chip module with stacked face-down connected dies

INVENSAS CORP

Mixed exposure for large die

Structure for microelectronic packaging with bond elements to encapsulation surface

BVA interposer

Structure for microelectronic packaging with bond elements to encapsulation surface

Multi-die wirebond packages with elongated windows

Stub minimization using duplicate sets of signal terminals

RAMBUS INC

Multiple channel modules and bus systems using same

Multiple channel modules and bus systems using same

Semiconductor module with imbedded heat spreader

Redistributed bond pads in stacked integrated circuit die package

OGANESIAN VAGE

Microelectronic elements with post-assembly planarization

Microelectronic elements having metallic pads overlying vias

XCELSIS CORP

Systems and methods for releveled bump planes for chiplets

INVENSAS LLC

Nanowire bonding interconnect for fine-pitch microelectronics

MOHAMMED ILYAS

Low stress vias

CRISP RICHARD DEWITT

Stub minimization for wirebond assemblies without windows