Inventor
HATSUDA TOSHIO
JP6 patents
Patents
6 patentsUS5270572ADec 14, 1993
Liquid impingement cooling module for semiconductor devices
HITACHI LTD188 citations99
US5365400ANov 15, 1994
Heat sinks and semiconductor cooling device using the heat sinks
HITACHI LTD119 citations97
US5089936AFeb 18, 1992
Semiconductor module
HITACHI LTD64 citations96
US4942452AJul 17, 1990
Lead frame and semiconductor device
HITACHI LTD72 citations95
US5276586AJan 4, 1994
Bonding structure of thermal conductive members for a multi-chip module
HITACHI LTD69 citations94
USRE37690EMay 7, 2002
Lead frame and semiconductor device
HITACHI LTD25 citations91