Inventor
OKA HITOSHI
JP35 patents
⚠️ This page may combine multiple inventors who share the name “OKA HITOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
22 patentsUS5979475ANov 9, 1999
Specimen holding method and fluid treatment method of specimen surface and systems therefor
HITACHI LTD134 citations97
US5388328AFeb 14, 1995
Process for fabricating an interconnected multilayer board
HITACHI LTD69 citations95
US5300735AApr 5, 1994
Interconnected multilayer boards and fabrication processes thereof
HITACHI LTD42 citations95
US5409544AApr 25, 1995
Method of controlling adhesion of fine particles to an object in liquid
HITACHI LTD24 citations92
US5256247AOct 26, 1993
Liquid etchant composition for thin film resistor element
HITACHI LTD40 citations92
US4563217AJan 7, 1986
Electroless copper plating solution
HITACHI LTD34 citations92
US4303443ADec 1, 1981
Electroless copper plating solution
HITACHI LTD29 citations92
US5387493AFeb 7, 1995
Photosensitive resin composition for forming conductor patterns and multilayer circuit boards using same
HITACHI LTD26 citations91
US6539959B1Apr 1, 2003
Cleaning apparatus for plate-like part and method thereof
HITACHI LTD22 citations90
US5348590ASep 20, 1994
Surface treating agent for copper or copper alloys
HITACHI LTD30 citations84
US4460718AJul 17, 1984
Epoxy resin composition
HITACHI LTD22 citations82
US4324629AApr 13, 1982
Process for regenerating chemical copper plating solution
HITACHI LTD26 citations82
US4276323AJun 30, 1981
Process for controlling of chemical copper plating solution
HITACHI LTD23 citations82
US4347304AAug 31, 1982
Process for forming metallic image
HITACHI LTD14 citations74
US4211564AJul 8, 1980
Chemical copper plating solution
HITACHI LTD17 citations74
US5633175AMay 27, 1997
Process for stripping photoresist while producing liquid crystal display device
HITACHI LTD8 citations73
US4555532ANov 26, 1985
Epoxy resin composition
HITACHI LTD12 citations73
US5268255ADec 7, 1993
Photo-setting resist composition, a process for producing a printed circuit board by using the composition, and a printed circuit board obtained by using the composition
HITACHI LTD19 citations69
US4735853AApr 5, 1988
Magnetic recording medium having an amorphous, nonmagnetic nickel-tungston-phosphorus underlayer
HITACHI LTD9 citations69
US4310563AJan 12, 1982
Method for automatically controlling composition of chemical copper plating solution
HITACHI LTD6 citations63
US5399202AMar 21, 1995
Resist-peeling liquid and process for peeling a resist using the same
HITACHI LTD6 citations62
US5091283AFeb 25, 1992
Photocurable diallyl phthalate resin composition and printed circuit board using the same
HITACHI LTD5 citations58
TDK CORP
6 patentsUS6461532B1Oct 8, 2002
Piezoelectric ceramic material
TDK CORP17 citations82
US6241908B1Jun 5, 2001
Piezoelectric ceramics
TDK CORP17 citations82
US6398978B1Jun 4, 2002
Piezoelectric ceramic
TDK CORP10 citations74
US6129886AOct 10, 2000
Method of preparation of piezoelectric ceramics
TDK CORP10 citations70
US6090306AJul 18, 2000
Piezoelectric ceramics
TDK CORP5 citations61
US6551522B2Apr 22, 2003
Piezoelectric ceramics
TDK CORP6 citations60