Inventor

SHIMAMOTO HARUO

JP19 patents

⚠️ This page may combine multiple inventors who share the name “SHIMAMOTO HARUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHIMAMOTO HARUO

MITSUBISHI ELECTRIC CORP

Plastic molded semiconductor package

Plastic molded semiconductor package and method of manufacturing the same

Plastic molded semiconductor package and method of manufacturing the same

Plastic molded semiconductor package and method of manufacturing the same

Semiconductor integrated circuit apparatus including clamped heat sink

Tape automated bonding packaged semiconductor device incorporating a heat sink

Semiconductor device having particular power distribution interconnection arrangement

Carrier tape including molten resin flow path element for resin packaged semiconductor devices

Tape carrier for tape automated bonding process and a method of producing the same

Manufacturing method for semiconductor device

Semiconductor device

Semiconductor device

Package structure for semiconductor device

Laser OLB apparatus and method of mounting semiconductor device

Outer lead bonding device utilizing tape carriers

Semiconductor device and manufacturing method thereof

ROHM CO LTD

Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure

ABE YOSHIYUKI

Method of manufacturing semiconductor device

MORIFUJI TADAHIRO

Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure