Inventor
KUSAKA TERUO
JP7 patents
Patents
7 patentsUS5600180AFeb 4, 1997
Sealing structure for bumps on a semiconductor integrated circuit chip
NEC CORP129 citations97
US6201346B1Mar 13, 2001
EL display device using organic EL element having a printed circuit board
NEC CORP91 citations96
US5367765ANov 29, 1994
Method of fabricating integrated circuit chip package
NEC CORP34 citations91
US5297333AMar 29, 1994
Packaging method for flip-chip type semiconductor device
NEC CORP47 citations91
US5896006AApr 20, 1999
Organic thin film light-emitting device having second electrodes layer covering periphery of first electrodes layer
NEC CORP42 citations88
US6025610AFeb 15, 2000
Solid relay and method of producing the same
NEC CORP15 citations72
US4694319ASep 15, 1987
Thyristor having a controllable gate trigger current
NEC CORP1 citations50