Inventor
COMBS EDWARD G
US10 patents
Patents
10 patentsUS6724071B2Apr 20, 2004
Molded plastic package with heat sink and enhanced electrical performance
ASAT LTD180 citations98
US6285075B1Sep 4, 2001
Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly
ASAT LTD280 citations98
US5596231AJan 21, 1997
High power dissipation plastic encapsulated package for integrated circuit die
ASAT LTD203 citations98
US6552417B2Apr 22, 2003
Molded plastic package with heat sink and enhanced electrical performance
ASAT LTD113 citations97
US6284569B1Sep 4, 2001
Method of manufacturing a flexible integrated circuit package utilizing an integrated carrier ring/stiffener
ASAT LTD181 citations97
US6111324AAug 29, 2000
Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package
ASAT LTD137 citations97
US6734552B2May 11, 2004
Enhanced thermal dissipation integrated circuit package
ASAT LTD241 citations95
US6326678B1Dec 4, 2001
Molded plastic package with heat sink and enhanced electrical performance
ASAT LTD305 citations95
US7015072B2Mar 21, 2006
Method of manufacturing an enhanced thermal dissipation integrated circuit package
ASAT LTD54 citations92
US6790710B2Sep 14, 2004
Method of manufacturing an integrated circuit package
ASAT LTD56 citations91