Inventor
HINKLE S DEREK
US9 patents
Patents
9 patentsUS6140154AOct 31, 2000
Multi-part lead frame with dissimilar materials and method of manufacturing
MICRON TECHNOLOGY INC152 citations98
US6072228AJun 6, 2000
Multi-part lead frame with dissimilar materials and method of manufacturing
MICRON TECHNOLOGY INC201 citations98
US6885108B2Apr 26, 2005
Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein
MICRON TECHNOLOGY INC16 citations92
US6362022B1Mar 26, 2002
Multi-part lead frame with dissimilar materials and method of manufacturing
MICRON TECHNOLOGY INC24 citations92
US6570244B1May 27, 2003
Multi-part lead frame with dissimilar materials
MICRON TECHNOLOGY INC12 citations82
US7321160B2Jan 22, 2008
Multi-part lead frame
MICRON TECHNOLOGY INC5 citations73
US6946722B2Sep 20, 2005
Multi-part lead frame with dissimilar materials
MICRON TECHNOLOGY INC6 citations73
US6902952B2Jun 7, 2005
Multi-part lead frame with dissimilar materials and method of manufacturing
MICRON TECHNOLOGY INC6 citations73
US7199464B2Apr 3, 2007
Semiconductor device structures including protective layers formed from healable materials
MICRON TECHNOLOGY INC1 citations52