Inventor
ANG BOON YONG
US20 patents
⚠️ This page may combine multiple inventors who share the name “ANG BOON YONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XILINX INC
9 patentsUS7710813B1May 4, 2010
Electronic fuse array
XILINX INC73 citations96
US7923811B1Apr 12, 2011
Electronic fuse cell with enhanced thermal gradient
XILINX INC23 citations92
US7834659B1Nov 16, 2010
Multi-step programming of E fuse cells
XILINX INC21 citations92
US7724600B1May 25, 2010
Electronic fuse programming current generator with on-chip reference
XILINX INC37 citations92
US7312625B1Dec 25, 2007
Test circuit and method of use thereof for the manufacture of integrated circuits
XILINX INC22 citations92
US7294888B1Nov 13, 2007
CMOS-compatible non-volatile memory cell with lateral inter-poly programming layer
XILINX INC21 citations92
US7567449B2Jul 28, 2009
One-time-programmable logic bit with multiple logic elements
XILINX INC8 citations84
US7598749B1Oct 6, 2009
Integrated circuit with fuse programming damage detection
XILINX INC12 citations83
US7688639B1Mar 30, 2010
CMOS-compatible non-volatile memory cell with lateral inter-poly programming layer
XILINX INC0 citations52
ADVANCED MICRO DEVICES INC
5 patentsUS6627484B1Sep 30, 2003
Method of forming a buried interconnect on a semiconductor on insulator wafer and a device including a buried interconnect
ADVANCED MICRO DEVICES INC22 citations92
US6824446B1Nov 30, 2004
Method and apparatus for polishing an outer edge ring on a semiconductor wafer
ADVANCED MICRO DEVICES INC7 citations72
US6328641B1Dec 11, 2001
Method and apparatus for polishing an outer edge ring on a semiconductor wafer
ADVANCED MICRO DEVICES INC7 citations72
US6589860B1Jul 8, 2003
System and method for calibrating electron beam defect inspection tool
ADVANCED MICRO DEVICES INC10 citations65
US6866416B1Mar 15, 2005
Detecting heat generating failures in unpassivated semiconductor devices
ADVANCED MICRO DEVICES INC6 citations58
SPANSION LLC
4 patentsUS6974989B1Dec 13, 2005
Structure and method for protecting memory cells from UV radiation damage and UV radiation-induced charging during backend processing
SPANSION LLC13 citations83
US7242102B2Jul 10, 2007
Bond pad structure for copper metallization having increased reliability and method for fabricating same
SPANSION LLC6 citations62
US7381620B1Jun 3, 2008
Oxygen elimination for device processing
SPANSION LLC0 citations52
US7122465B1Oct 17, 2006
Method for achieving increased control over interconnect line thickness across a wafer and between wafers
SPANSION LLC1 citations51