Inventor

YU PARK-KEE

US3 patents

⚠️ This page may combine multiple inventors who share the name “YU PARK-KEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEWLETT PACKARD CO

1 patent

US6011314AJan 4, 2000

Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps

HEWLETT PACKARD CO189 citations96

AGILENT TECHNOLOGIES INC

1 patent

US6683298B1Jan 27, 2004

Image sensor packaging with package cavity sealed by the imaging optics

AGILENT TECHNOLOGIES INC93 citations94

AVAGO TECHNOLOGIES GENERAL IP

1 patent

US7088397B1Aug 8, 2006

Image sensor packaging with imaging optics

AVAGO TECHNOLOGIES GENERAL IP49 citations89