Inventor
CHEN CHUN-HON
TW16 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHUN-HON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
15 patentsUS6329234B1Dec 11, 2001
Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flow
TAIWAN SEMICONDUCTOR MFG212 citations98
US6472721B2Oct 29, 2002
Dual damascene interconnect structures that include radio frequency capacitors and inductors
TAIWAN SEMICONDUCTOR MFG60 citations95
US7050290B2May 23, 2006
Integrated capacitor
TAIWAN SEMICONDUCTOR MFG21 citations92
US6949781B2Sep 27, 2005
Metal-over-metal devices and the method for manufacturing same
TAIWAN SEMICONDUCTOR MFG26 citations92
US6583491B1Jun 24, 2003
Microelectronic fabrication having microelectronic capacitor structure fabricated therein
TAIWAN SEMICONDUCTOR MFG28 citations92
US7317221B2Jan 8, 2008
High density MIM capacitor structure and fabrication process
TAIWAN SEMICONDUCTOR MFG29 citations91
US7294544B1Nov 13, 2007
Method of making a metal-insulator-metal capacitor in the CMOS process
TAIWAN SEMICONDUCTOR MFG44 citations91
US6916722B2Jul 12, 2005
Method to fabricate high reliable metal capacitor within copper back-end process
TAIWAN SEMICONDUCTOR MFG22 citations91
US6734079B2May 11, 2004
Microelectronic fabrication having sidewall passivated microelectronic capacitor structure fabricated therein
TAIWAN SEMICONDUCTOR MFG27 citations91
US6881996B2Apr 19, 2005
Metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer
TAIWAN SEMICONDUCTOR MFG15 citations83
US7122878B2Oct 17, 2006
Method to fabricate high reliable metal capacitor within copper back-end process
TAIWAN SEMICONDUCTOR MFG12 citations82
US7035083B2Apr 25, 2006
Interdigitated capacitor and method for fabrication thereof
TAIWAN SEMICONDUCTOR MFG10 citations74
US6812088B1Nov 2, 2004
Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer
TAIWAN SEMICONDUCTOR MFG11 citations73
US6667217B1Dec 23, 2003
Method of fabricating a damascene copper inductor structure using a sub-0.18 um CMOS process
TAIWAN SEMICONDUCTOR MFG12 citations73
US6051475AApr 18, 2000
Method for manufacturing a silicide to silicide capacitor
TAIWAN SEMICONDUCTOR MFG6 citations63