Inventor

GERBER MARK A

US28 patents

⚠️ This page may combine multiple inventors who share the name “GERBER MARK A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GERBER MARK A

TEXAS INSTRUMENTS INC

Method for fine-pitch, low stress flip-chip interconnect

Array molded package-on-package having redistribution lines

Packaged system of semiconductor chips having a semiconductor interposer

Packed system of semiconductor chips having a semiconductor interposer

Vertically integrated system-in-a-package

Semiconductor package-on-package system including integrated passive components

Method for stacking semiconductor chips

Packaged semiconductor devices

Method for fabricating array-molded package-on-package

Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices

Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices

Method and structure of packaging semiconductor devices

DALLAS SEMICONDUCTOR

Electrical contact clip

Power cap cover

Replaceable power module

Power module cover

Power cap

Power cap

Replaceable power module

FREESCALE SEMICONDUCTOR INC

Semiconductor package device for use with multiple integrated circuits in a stacked configuration and method of formation and testing

Multi-die semiconductor package

Packaged semiconductor device and method of formation

Low profile semiconductor device having improved heat dissipation

GERBER MARK A

Packaged system of semiconductor chips having a semiconductor interposer

Array-molded package-on-package having redistribution lines

Method for exposing and cleaning insulating coats from metal contact surfaces

CASTRO ABRAM M

Semiconductor flip-chip system having oblong connectors and reduced trace pitches

SOUTHWEST AIRLINES CO

Method and apparatus for preventing the interception of data being transmitted to a web site by a monitoring program