Inventor
GHAHGHAHI FARSHAD
US23 patents
⚠️ This page may combine multiple inventors who share the name “GHAHGHAHI FARSHAD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
17 patentsUS6114761ASep 5, 2000
Thermally-enhanced flip chip IC package with extruded heatspreader
LSI LOGIC CORP152 citations97
US6150729ANov 21, 2000
Routing density enhancement for semiconductor BGA packages and printed wiring boards
LSI LOGIC CORP72 citations96
US6762366B1Jul 13, 2004
Ball assignment for ball grid array package
LSI LOGIC CORP39 citations92
US6671865B1Dec 30, 2003
High density input output
LSI LOGIC CORP41 citations92
US6531932B1Mar 11, 2003
Microstrip package having optimized signal line impedance control
LSI LOGIC CORP23 citations92
US6115910ASep 12, 2000
Misregistration fidutial
LSI LOGIC CORP27 citations92
US6407462B1Jun 18, 2002
Irregular grid bond pad layout arrangement for a flip chip package
LSI LOGIC CORP36 citations90
US7081672B1Jul 25, 2006
Substrate via layout to improve bias humidity testing reliability
LSI LOGIC CORP15 citations83
US6459049B1Oct 1, 2002
High density signal routing
LSI LOGIC CORP14 citations83
US7051434B2May 30, 2006
Designing a ball assignment for a ball grid array package
LSI LOGIC CORP7 citations73
US6946866B2Sep 20, 2005
Measurement of package interconnect impedance using tester and supporting tester
LSI LOGIC CORP7 citations72
US6479319B1Nov 12, 2002
Contact escape pattern
LSI LOGIC CORP11 citations72
US7405946B2Jul 29, 2008
Ball grid array assignment
LSI LOGIC CORP3 citations63
US7105926B2Sep 12, 2006
Routing scheme for differential pairs in flip chip substrates
LSI LOGIC CORP5 citations62
US7345245B2Mar 18, 2008
Robust high density substrate design for thermal cycling reliability
LSI LOGIC CORP3 citations61
US6825066B2Nov 30, 2004
Stiffener design
LSI LOGIC CORP1 citations51
US7319272B2Jan 15, 2008
Ball assignment system
LSI LOGIC CORP0 citations41
ADVANCED MICRO DEVICES INC
5 patentsUS11955447B2Apr 9, 2024
Semiconductor chip having stepped conductive pillars
ADVANCED MICRO DEVICES INC2 citations71
US10903168B2Jan 26, 2021
Multi-RDL structure packages and methods of fabricating the same
ADVANCED MICRO DEVICES INC0 citations62
US12417994B2Sep 16, 2025
Semiconductor chip having stepped conductive pillars
ADVANCED MICRO DEVICES INC0 citations61
US11315883B2Apr 26, 2022
Integrated circuit product customizations for identification code visibility
ADVANCED MICRO DEVICES INC0 citations58
US12482683B2Nov 25, 2025
Carrier boat for die package flux cleaning
ADVANCED MICRO DEVICES INC0 citations45