Inventor
KANG SEAN S
US34 patents
⚠️ This page may combine multiple inventors who share the name “KANG SEAN S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
17 patentsUS9269590B2Feb 23, 2016
Spacer formation
APPLIED MATERIALS INC195 citations99
US8980758B1Mar 17, 2015
Methods for etching an etching stop layer utilizing a cyclical etching process
APPLIED MATERIALS INC192 citations98
US8895449B1Nov 25, 2014
Delicate dry clean
APPLIED MATERIALS INC182 citations98
US9543163B2Jan 10, 2017
Methods for forming features in a material layer utilizing a combination of a main etching and a cyclical etching process
APPLIED MATERIALS INC114 citations97
US8748322B1Jun 10, 2014
Silicon oxide recess etch
APPLIED MATERIALS INC125 citations97
US9412579B2Aug 9, 2016
Methods and apparatus for controlling substrate uniformity
APPLIED MATERIALS INC16 citations92
US8992792B2Mar 31, 2015
Method of fabricating an ultra low-k dielectric self-aligned via
APPLIED MATERIALS INC20 citations92
US10636704B2Apr 28, 2020
Seam-healing method upon supra-atmospheric process in diffusion promoting ambient
APPLIED MATERIALS INC14 citations86
US10269571B2Apr 23, 2019
Methods for fabricating nanowire for semiconductor applications
APPLIED MATERIALS INC19 citations86
US10593518B1Mar 17, 2020
Methods and apparatus for etching semiconductor structures
APPLIED MATERIALS INC9 citations83
US12198951B2Jan 14, 2025
High pressure wafer processing systems and related methods
APPLIED MATERIALS INC1 citations74
US10177050B2Jan 8, 2019
Methods and apparatus for controlling substrate uniformity
APPLIED MATERIALS INC5 citations72
US12354973B2Jul 8, 2025
Stress and overlay management for semiconductor processing
APPLIED MATERIALS INC0 citations61
US11164723B2Nov 2, 2021
Methods and apparatus for etching semiconductor structures
APPLIED MATERIALS INC0 citations61
US10930471B2Feb 23, 2021
Methods and apparatus for etching semiconductor structures
APPLIED MATERIALS INC0 citations61
US11373877B2Jun 28, 2022
Methods and apparatus for in-situ protection liners for high aspect ratio reactive ion etching
APPLIED MATERIALS INC1 citations58
US12467139B2Nov 11, 2025
Multizone flow distribution system
APPLIED MATERIALS INC0 citations50
LAM RES CORP
9 patentsUS7084070B1Aug 1, 2006
Treatment for corrosion in substrate processing
LAM RES CORP247 citations99
US7307025B1Dec 11, 2007
Lag control
LAM RES CORP26 citations91
US7250371B2Jul 31, 2007
Reduction of feature critical dimensions
LAM RES CORP27 citations91
US6930048B1Aug 16, 2005
Etching a metal hard mask for an integrated circuit structure
LAM RES CORP43 citations91
US7192531B1Mar 20, 2007
In-situ plug fill
LAM RES CORP14 citations84
US6969685B1Nov 29, 2005
Etching a dielectric layer in an integrated circuit structure having a metal hard mask layer
LAM RES CORP18 citations84
US7541291B2Jun 2, 2009
Reduction of feature critical dimensions
LAM RES CORP11 citations83
US6919278B2Jul 19, 2005
Method for etching silicon carbide
LAM RES CORP10 citations73
US7789991B1Sep 7, 2010
Lag control
LAM RES CORP4 citations61
MICROMATERIALS LLC
4 patentsUS10720341B2Jul 21, 2020
Gas delivery system for high pressure processing chamber
MICROMATERIALS LLC20 citations94
US10224224B2Mar 5, 2019
High pressure wafer processing systems and related methods
MICROMATERIALS LLC19 citations93
US11527421B2Dec 13, 2022
Gas delivery system for high pressure processing chamber
MICROMATERIALS LLC2 citations73
US11756803B2Sep 12, 2023
Gas delivery system for high pressure processing chamber
MICROMATERIALS LLC0 citations62