Inventor

TAI WEN-CHUAN

TW50 patents

⚠️ This page may combine multiple inventors who share the name “TAI WEN-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAI WEN-CHUAN

TAIWAN SEMICONDUCTOR MFG CO LTD

Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS device

Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavity

Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications

Microelectromechanical systems (MEMS) devices at different pressures

Wafer-level packaging of solid-state biosensor, microfluidics, and through-silicon via

Semiconductor arrangement and formation thereof

MEMS device with enhanced sensing structure and manufacturing method thereof

Monolithic MEMS platform for integrated pressure, temperature, and gas sensor

Semiconductor arrangement and formation thereof

Semiconductor device and method of manufacturing

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

MEMS structure

Biosensor system with integrated microneedle

Piezoelectric anti-stiction structure for microelectromechanical systems

Biosensor system with integrated microneedle

Wafer-level packaging of solid-state biosensor, microfluidics, and through-silicon via

Bonding structure and method thereof

Piezoelectric anti-stiction structure for microelectromechanical systems

MEMS package comprising multi-depth trenches

Piezoelectric anti-stiction structure for microelectromechanical systems

MEMS device

Semiconductor arrangement and formation thereof

Apparatus and method of manufacturing for combo MEMS device accommodating different working pressures

Reduction of electric field enhanced moisture penetration by metal shielding

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

Method and system for detecting semiconductor device

Multi-depth MEMS package

Method for forming multi-depth MEMS package

MEMS structure with bilayer stopper and method for forming the same

Method for forming multi-depth MEMS package

Microelectromechanical systems (MEMS) devices at different pressures

Thin film structure for hermetic sealing

Semiconductor device and manufacturing method thereof

Dielectric protection layer configured to increase performance of mems device

Energy-harvesting device

Micro-electromechanical systems (MEMS) device with outgas layer

Method of selectively removing an anti-stiction layer on a eutectic bonding area

TAIWAN SEMICONDUCTOR MFG

Structure and method of providing a re-distribution layer (RDL) and a through-silicon via (TSV)

Micro-electro mechanical system (MEMS) structures and methods of forming the same

Sensor with energy-harvesting device

Energy-harvesting device and method of forming the same

Method of manufacturing a MEMS device

SHU CHIA-PAO

Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the same

Structure and method for motion sensor

Hybrid MEMS bump design to prevent in-process and in-use stiction

CHUNG TIEN-KAN

Sensor with energy-harvesting device

MEMS kinetic energy conversion

HUNG CHIA-MING

Electrical bypass structure for MEMS device

LIANG KAI-CHIH

Inline process control structures