Inventor
MINNICH JEREMY E
US11 patents
Patents
11 patentsUS7476955B2Jan 13, 2009
Die package having an adhesive flow restriction area
MICRON TECHNOLOGY INC17 citations92
US10090177B1Oct 2, 2018
Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
MICRON TECHNOLOGY INC5 citations82
US10276539B1Apr 30, 2019
Method for 3D ink jet TCB interconnect control
MICRON TECHNOLOGY INC7 citations79
US11594432B2Feb 28, 2023
Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
MICRON TECHNOLOGY INC2 citations71
US10410891B2Sep 10, 2019
Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
MICRON TECHNOLOGY INC1 citations71
US7491570B2Feb 17, 2009
Die package having an adhesive flow restriction area
MICRON TECHNOLOGY INC2 citations62
US11670612B2Jun 6, 2023
Method for solder bridging elimination for bulk solder C2S interconnects
MICRON TECHNOLOGY INC1 citations61
US10998208B2May 4, 2021
Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
MICRON TECHNOLOGY INC0 citations60
US10043688B1Aug 7, 2018
Method for mount tape die release system for thin die ejection
MICRON TECHNOLOGY INC0 citations52
US10700038B2Jun 30, 2020
Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing tool
MICRON TECHNOLOGY INC0 citations50
US10879195B2Dec 29, 2020
Method for substrate moisture NCF voiding elimination
MICRON TECHNOLOGY INC0 citations40