Inventor
HAN KYUNG TAEG
KR27 patents
⚠️ This page may combine multiple inventors who share the name “HAN KYUNG TAEG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
13 patentsUS7501656B2Mar 10, 2009
Light emitting diode package with diffuser and method of manufacturing the same
SAMSUNG ELECTRO MECH486 citations99
US7458703B2Dec 2, 2008
Light emitting diode package having dual lens structure for lateral light emission
SAMSUNG ELECTRO MECH60 citations98
US7208772B2Apr 24, 2007
High power light emitting diode package
SAMSUNG ELECTRO MECH69 citations98
US7156538B2Jan 2, 2007
LED package for backlight unit
SAMSUNG ELECTRO MECH66 citations97
US7714342B2May 11, 2010
Chip coated light emitting diode package and manufacturing method thereof
SAMSUNG ELECTRO MECH41 citations96
US7626250B2Dec 1, 2009
High power LED package and fabrication method thereof
SAMSUNG ELECTRO MECH19 citations93
USD512694SDec 13, 2005
Light-emitting diode
SAMSUNG ELECTRO MECH33 citations93
USD512029SNov 29, 2005
Light-emitting diode
SAMSUNG ELECTRO MECH27 citations93
US7687292B2Mar 30, 2010
Light emitting diode package with metal reflective layer and method of manufacturing the same
SAMSUNG ELECTRO MECH12 citations84
US7338823B2Mar 4, 2008
Side-emitting LED package and manufacturing method of the same
SAMSUNG ELECTRO MECH16 citations84
US7462871B2Dec 9, 2008
Side-view light emitting diode having protective device
SAMSUNG ELECTRO MECH16 citations83
US7102283B2Sep 5, 2006
Full-color light emitting device with four leads
SAMSUNG ELECTRO MECH2 citations60
US7678592B2Mar 16, 2010
LED housing and fabrication method thereof
SAMSUNG ELECTRO MECH4 citations58
SAMSUNG LED CO LTD
6 patentsUS8013352B2Sep 6, 2011
Chip coated light emitting diode package and manufacturing method thereof
SAMSUNG LED CO LTD479 citations99
US7790482B2Sep 7, 2010
Light emitting diode package with diffuser and method of manufacturing the same
SAMSUNG LED CO LTD474 citations99
US7833811B2Nov 16, 2010
Side-emitting LED package and method of manufacturing the same
SAMSUNG LED CO LTD14 citations84
US7887225B2Feb 15, 2011
Direct-type backlight unit having surface light source
SAMSUNG LED CO LTD8 citations83
US7875476B2Jan 25, 2011
High power LED package and fabrication method thereof
SAMSUNG LED CO LTD5 citations63
US7795052B2Sep 14, 2010
Chip coated light emitting diode package and manufacturing method thereof
SAMSUNG LED CO LTD3 citations63
LEE SEON GOO
4 patentsUS8324646B2Dec 4, 2012
Chip coated light emitting diode package and manufacturing method thereof
LEE SEON GOO479 citations98
USRE44811EMar 18, 2014
High power light emitting diode package
LEE SEON GOO0 citations52
USRE43200EFeb 21, 2012
High power light emitting diode package
LEE SEON GOO0 citations52
US8169128B2May 1, 2012
LED package having recess in heat conducting part
LEE SEON GOO0 citations41