Inventor
HAN SEONG YEON
KR39 patents
⚠️ This page may combine multiple inventors who share the name “HAN SEONG YEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
10 patentsUS7501656B2Mar 10, 2009
Light emitting diode package with diffuser and method of manufacturing the same
SAMSUNG ELECTRO MECH486 citations99
US7458703B2Dec 2, 2008
Light emitting diode package having dual lens structure for lateral light emission
SAMSUNG ELECTRO MECH60 citations98
US7714342B2May 11, 2010
Chip coated light emitting diode package and manufacturing method thereof
SAMSUNG ELECTRO MECH41 citations96
US7626250B2Dec 1, 2009
High power LED package and fabrication method thereof
SAMSUNG ELECTRO MECH19 citations93
USD599750SSep 8, 2009
Case for light emitting diode
SAMSUNG ELECTRO MECH23 citations93
US7687292B2Mar 30, 2010
Light emitting diode package with metal reflective layer and method of manufacturing the same
SAMSUNG ELECTRO MECH12 citations84
USD595245SJun 30, 2009
Light-emitting diode
SAMSUNG ELECTRO MECH14 citations84
US7338823B2Mar 4, 2008
Side-emitting LED package and manufacturing method of the same
SAMSUNG ELECTRO MECH16 citations84
USD595247SJun 30, 2009
Light-emitting diode
SAMSUNG ELECTRO MECH4 citations63
USD595246SJun 30, 2009
Light-emitting diode
SAMSUNG ELECTRO MECH0 citations52
SAMSUNG LED CO LTD
9 patentsUS8013352B2Sep 6, 2011
Chip coated light emitting diode package and manufacturing method thereof
SAMSUNG LED CO LTD479 citations99
US7959312B2Jun 14, 2011
White light emitting device and white light source module using the same
SAMSUNG LED CO LTD487 citations99
US7790482B2Sep 7, 2010
Light emitting diode package with diffuser and method of manufacturing the same
SAMSUNG LED CO LTD474 citations99
US7964885B2Jun 21, 2011
White light emitting device and white light source module using the same
SAMSUNG LED CO LTD8 citations84
US7833811B2Nov 16, 2010
Side-emitting LED package and method of manufacturing the same
SAMSUNG LED CO LTD14 citations84
US7914194B2Mar 29, 2011
Backlight unit having light emititng diodes and method of manufacturing the same
SAMSUNG LED CO LTD2 citations63
US7894017B2Feb 22, 2011
Plane light source and LCD backlight unit having the same
SAMSUNG LED CO LTD2 citations63
US7875476B2Jan 25, 2011
High power LED package and fabrication method thereof
SAMSUNG LED CO LTD5 citations63
US7795052B2Sep 14, 2010
Chip coated light emitting diode package and manufacturing method thereof
SAMSUNG LED CO LTD3 citations63
HYUNDAI MOBIS CO LTD
8 patentsUS12213228B2Jan 28, 2025
System and method for controlling lamp of vehicle
HYUNDAI MOBIS CO LTD1 citations64
US12221029B2Feb 11, 2025
DMD lamp and method of controlling DMD lamp
HYUNDAI MOBIS CO LTD0 citations52
US12135117B2Nov 5, 2024
Lamp heat dissipation system
HYUNDAI MOBIS CO LTD0 citations52
US11904758B2Feb 20, 2024
Variable beam pattern lamp system for driver and control method thereof
HYUNDAI MOBIS CO LTD0 citations52
US11644173B2May 9, 2023
Lamp for vehicle and vehicle including the same
HYUNDAI MOBIS CO LTD0 citations52
US9890919B2Feb 13, 2018
Lamp lens with reduced chromatic aberration and lamp for vehicle using the same
HYUNDAI MOBIS CO LTD0 citations52
US9335018B2May 10, 2016
LED lamp including reflectors for vehicle and vehicle having the same
HYUNDAI MOBIS CO LTD1 citations52
US9140423B2Sep 22, 2015
Multi-array LED chip for vehicle and head lamp having the same
HYUNDAI MOBIS CO LTD0 citations52