Inventor
IVANOV IGOR C
US27 patents
⚠️ This page may combine multiple inventors who share the name “IVANOV IGOR C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
9 patentsUS7897507B2Mar 1, 2011
Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
LAM RES CORP8 citations92
US7636234B2Dec 22, 2009
Apparatus configurations for affecting movement of fluids within a microelectric topography processing chamber
LAM RES CORP9 citations92
US7883739B2Feb 8, 2011
Method for strengthening adhesion between dielectric layers formed adjacent to metal layers
LAM RES CORP6 citations74
US8808791B2Aug 19, 2014
Method for strengthening adhesion between dielectric layers formed adjacent to metal layers
LAM RES CORP1 citations63
US7651723B2Jan 26, 2010
Microelectronic fabrication system components and method for processing a wafer using such components
LAM RES CORP2 citations63
US9953866B1Apr 24, 2018
Methods for forming a barrier layer with periodic concentrations of elements and structures resulting thereform
LAM RES CORP0 citations52
US8003159B2Aug 23, 2011
Methods and systems for processing a microelectronic topography
LAM RES CORP0 citations52
US7648913B2Jan 19, 2010
Method of electroless deposition of thin metal and dielectric films with temperature controlled stages of film growth
LAM RES CORP0 citations52
US7393414B2Jul 1, 2008
Methods and systems for processing a microelectronic topography
LAM RES CORP0 citations52
BLUE29 LLC
7 patentsUS6881437B2Apr 19, 2005
Methods and system for processing a microelectronic topography
BLUE29 LLC112 citations98
US6860944B2Mar 1, 2005
Microelectronic fabrication system components and method for processing a wafer using such components
BLUE29 LLC55 citations96
US7235483B2Jun 26, 2007
Method of electroless deposition of thin metal and dielectric films with temperature controlled stages of film growth
BLUE29 LLC26 citations92
US6911067B2Jun 28, 2005
Solution composition and method for electroless deposition of coatings free of alkali metals
BLUE29 LLC30 citations92
US6908512B2Jun 21, 2005
Temperature-controlled substrate holder for processing in fluids
BLUE29 LLC34 citations92
US6846519B2Jan 25, 2005
Method and apparatus for electroless deposition with temperature-controlled chuck
BLUE29 LLC13 citations83
US6935638B2Aug 30, 2005
Universal substrate holder for treating objects in fluids
BLUE29 LLC18 citations82
IVANOV IGOR C
6 patentsUS8906446B2Dec 9, 2014
Apparatus and method for electroless deposition of materials on semiconductor substrates
IVANOV IGOR C6 citations83
US8586133B2Nov 19, 2013
Method for strengthening adhesion between dielectric layers formed adjacent to metal layers
IVANOV IGOR C3 citations62
US8502381B2Aug 6, 2013
Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
IVANOV IGOR C2 citations62
US8143161B2Mar 27, 2012
Method for passivating hardware of a microelectronic topography processing chamber
IVANOV IGOR C2 citations62
US8128987B2Mar 6, 2012
Apparatus and method for electroless deposition of materials on semiconductor substrates
IVANOV IGOR C1 citations61
US8591985B2Nov 26, 2013
Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes
IVANOV IGOR C0 citations51
LAM RES
3 patentsUS7884033B2Feb 8, 2011
Method of depositing fluids within a microelectric topography processing chamber
LAM RES7 citations83
US7779782B2Aug 24, 2010
Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes
LAM RES7 citations73
US7714441B2May 11, 2010
Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
LAM RES7 citations73