Inventor
MANATAD ROMEL N
PH21 patents
⚠️ This page may combine multiple inventors who share the name “MANATAD ROMEL N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FAIRCHILD SEMICONDUCTOR
15 patentsUS6720642B1Apr 13, 2004
Flip chip in leaded molded package and method of manufacture thereof
FAIRCHILD SEMICONDUCTOR137 citations98
US7217594B2May 15, 2007
Alternative flip chip in leaded molded package design and method for manufacture
FAIRCHILD SEMICONDUCTOR63 citations97
US7215011B2May 8, 2007
Flip chip in leaded molded package and method of manufacture thereof
FAIRCHILD SEMICONDUCTOR65 citations97
US7154168B2Dec 26, 2006
Flip chip in leaded molded package and method of manufacture thereof
FAIRCHILD SEMICONDUCTOR64 citations97
US6943434B2Sep 13, 2005
Method for maintaining solder thickness in flipchip attach packaging processes
FAIRCHILD SEMICONDUCTOR133 citations97
US7122884B2Oct 17, 2006
Robust leaded molded packages and methods for forming the same
FAIRCHILD SEMICONDUCTOR106 citations94
US6949410B2Sep 27, 2005
Flip chip in leaded molded package and method of manufacture thereof
FAIRCHILD SEMICONDUCTOR24 citations92
US7906837B2Mar 15, 2011
Robust leaded molded packages and methods for forming the same
FAIRCHILD SEMICONDUCTOR28 citations89
US7586178B2Sep 8, 2009
Alternative flip chip in leaded molded package design and method for manufacture
FAIRCHILD SEMICONDUCTOR12 citations84
US7816784B2Oct 19, 2010
Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same
FAIRCHILD SEMICONDUCTOR12 citations80
US7576429B2Aug 18, 2009
Packaged semiconductor device with dual exposed surfaces and method of manufacturing
FAIRCHILD SEMICONDUCTOR7 citations73
US7582956B2Sep 1, 2009
Flip chip in leaded molded package and method of manufacture thereof
FAIRCHILD SEMICONDUCTOR3 citations62
US7560311B2Jul 14, 2009
Robust leaded molded packages and methods for forming the same
FAIRCHILD SEMICONDUCTOR4 citations59
US7816178B2Oct 19, 2010
Packaged semiconductor device with dual exposed surfaces and method of manufacturing
FAIRCHILD SEMICONDUCTOR1 citations51
US9698143B2Jul 4, 2017
Wireless module with active devices
FAIRCHILD SEMICONDUCTOR0 citations30
SEMICONDUCTOR COMPONENTS IND LLC
5 patentsUS11088046B2Aug 10, 2021
Semiconductor device package with clip interconnect and dual side cooling
SEMICONDUCTOR COMPONENTS IND LLC3 citations72
US11791247B2Oct 17, 2023
Concealed gate terminal semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations70
US12051635B2Jul 30, 2024
Semiconductor device package with clip interconnect and dual side cooling
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US12300583B2May 13, 2025
Concealed gate terminal semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US12087677B2Sep 10, 2024
Molded packaging for wide band gap semiconductor devices
SEMICONDUCTOR COMPONENTS IND LLC0 citations49